Advanced Packaging SI/PI Senior Engineer

Job Title

Advanced Packaging SI/PI Senior Engineer

Role Summary

Perform signal integrity (SI) and power integrity (PI) analysis and optimization for advanced semiconductor package designs (2D/2.5D/3D). The role is part of the Advanced Packaging team and supports electrical performance, simulation sign-off, and cross-functional integration with physical designers and IP teams.

Primary responsibilities include running SI/PI simulations, automating analysis workflows, advising on routing and power delivery, and supporting EDA/tooling efforts for packaging design.

Experience Level

Senior — the listing indicates candidates typically have 3+ years of relevant experience (for example, a BS plus 3+ years) or an MS in a technical field.

Responsibilities

Deliver SI/PI simulation, analysis, and optimization for package designs and support cross-functional design activities.

• Perform SI/PI simulations and sign-off for 2D/2.5D/3D package designs.
• Run simulation tasks for signal and power integrity sign-off.
• Write scripts to automate simulation setup, data extraction, and post-processing.
• Work with physical designers and IP teams to optimize electrical performance.
• Contribute to wiring studies for signal routing, power delivery verification, and package-size decisions.
• Support PCAD/EDA tooling and internal tool development as capacity allows.
• Document analysis results and present findings in design reviews and cross-functional meetings.

Requirements

Technical skills and practical experience required to perform the role. Degree details are listed under Education Requirements below.

• Experience with SI/PI simulation tools such as Ansys HFSS, Keysight ADS, or Cadence Sigrity.
• Working knowledge of circuit extraction and simulation techniques.
• Scripting ability to automate simulations and process results.
• Familiarity with semiconductor packaging technologies, substrate materials, or PCB design.
• Strong communication and documentation skills; ability to present technical results.
• Ability to participate effectively in cross-functional design reviews.
• Interest in expanding into package and PCB electrical design work.

Nice-to-have: experience with 3D packaging, co-packaged optics, multi-chip configurations, or EDA/tool development for packaging workflows.

Education Requirements

BS in Electrical Engineering, Computer Engineering, or a related technical field with coursework or hands-on exposure to signal integrity and power delivery concepts plus 3+ years of related experience; OR MS in a technical field (Electrical Engineering, Computer Engineering, or related) with relevant coursework or practical exposure.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.