Advanced Packaging Process Integration Engineer
The Process Integration and Yield Engineer will define and execute technology-transfer roadmaps to integrate advanced packaging and backend assembly-test processes from NPI to high-volume manufacturing. The role leads yield and quality improvement efforts and works with cross-functional teams and external partners to ensure stable production ramps.
Mid-level. Typical experience expectations vary by degree: around 3+ years (Master's with 3 years or equivalent) to 4+ years (Bachelor's with 4 years); PhD may be considered with no experience.
Key responsibilities include:
Minimum technical and professional requirements. Degrees and formal education details are summarized separately below.
Bachelor's degree in Engineering, Material Science, Physics, or a related field with 4+ years relevant experience; or Master's degree in Engineering, Material Science, Physics, or a related field with 3+ years relevant experience; or PhD in Engineering, Material Science, Physics, or a related field (may be acceptable with no prior experience). Equivalent practical experience in related semiconductor process roles is an accepted substitute where noted.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
