Advanced Packaging Process Engineer
Intel CorporationJob Title
Advanced Packaging Process Engineer
Role Summary
Develop, optimize, and qualify advanced semiconductor packaging processes and equipment to support high-volume manufacturing within Intel's Advanced Packaging Technology Manufacturing organization. This is an on-site engineering role based in Intel's Arizona manufacturing campus (Phoenix, AZ).
Work cross-functionally to meet yield, reliability, quality, and cost targets and to support successful product launches.
Experience Level
Mid-level. Typical experience: Master’s degree plus 3+ years of relevant experience, or PhD plus 1+ year. Equivalent practical experience is considered.
Responsibilities
Primary responsibilities include process development, experimentation, qualification, and driving manufacturing standardization and improvements.
- Develop, optimize, and qualify packaging assembly processes and equipment for high-volume manufacturing.
- Design and execute experiments using Statistical Process Control (SPC) and Design of Experiments (DOE); analyze process capability and drive continuous improvement.
- Innovate techniques, materials, and tools to address packaging performance and reliability challenges.
- Collaborate with engineering, manufacturing, and product teams to identify technical risks and enable product launches.
- Define specifications for materials and equipment and ensure adherence to quality and operational standards.
- Document technical findings, process improvements, and qualification results in reports and qualification documents.
- Lead standardization efforts for manufacturing systems, equipment setups, and process flows across global sites.
Requirements
Must-have and preferred technical skills and experience (education summarized below).
- Process development and equipment qualification experience in a manufacturing setting. (Must)
- Experience with statistical analysis, SPC, DOE, and process characterization techniques. (Must)
- Experience with semiconductor packaging processes and assembly flows (e.g., flip chip, fan-out, 2.5D/3D integration). (Preferred)
- Data analysis skills; familiarity with Python, MATLAB, or SQL for complex data analysis. (Preferred)
- Familiarity with quality systems, documentation standards, and packaging reliability evaluation tools. (Preferred)
- Strong communication, collaboration, ownership mindset, and creative problem-solving skills. (Must)
- Position is not eligible for Intel immigration sponsorship. (Note)
Education Requirements
Master's degree plus 3+ years of relevant experience, or PhD in Mechanical Engineering, Physics, Chemistry, or a related STEM field with 1+ years of relevant experience. The posting also allows relevant experience obtained via coursework, projects, research, or internships; equivalent practical experience may be considered.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
