Advanced Packaging Modeling Engineer

Job Title

Advanced Packaging Modeling Engineer

Role Summary

Join GlobalFoundries' advanced packaging team at the 300mm fabrication facility in Malta, NY to provide mechanical, thermal or electrical modeling and simulation to guide 3D heterogeneous integration (3DHI) and advanced packaging decisions for logic, RF, analog and memory technologies.

Experience Level

Mid-level engineer. Typical background: M.S. + ~5 years or PhD + ~3 years of relevant modeling/simulation experience; role requires demonstrated practical experience applying commercial simulation tools to semiconductor packaging problems.

Responsibilities

Primary responsibilities focus on modeling-driven device and integration optimization, cross-team coordination, and communicating results to engineering teams.

• Perform mechanical, thermal or electrical simulations using commercial tools to evaluate and optimize 3DHI and packaging designs.
• Run stress simulations for active areas and evaluate impact of stress on device performance (mechanical modeling focus where applicable).
• Model process flows to identify integration or process concerns and anticipate issues from integration, process, or design enablement inputs.
• Collaborate with integration, device and design engineers to define critical simulations and drive technology decisions.
• Present simulation results clearly to small and large technical audiences.
• Support safety, environmental, health and security programs and perform other duties as assigned.

Requirements

Must-have technical skills and capabilities.

• Experience with semiconductor mechanical, thermal or electrical simulation tools (e.g., Ansys Mechanical Workbench or equivalent).
• Solid understanding of semiconductor processes and integration techniques.
• Strong computer and software skills; ability to apply commercial simulation packages to semiconductor process and packaging problems.
• Effective verbal and written English communication; able to present results to diverse technical audiences.
• Demonstrated attention to detail and timeliness; ability to work across functional teams.

Education Requirements

Required: M.S. plus a minimum of 5 years relevant experience, or PhD plus a minimum of 3 years relevant experience. Must have at least an overall 3.0 GPA and proven good academic standing. Degree fields are expected to align with mechanical, thermal, electrical, or related engineering disciplines relevant to semiconductor device and packaging modeling.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.