Advanced Packaging Metro Module Engineer

Job Title

Advanced Packaging Metro Module Engineer

Role Summary

Own and optimize high-volume manufacturing equipment and processes for advanced packaging technologies (e.g., FOVEROS-S, EMIB) to support production ramps and maintain product quality and yield. The role works cross-functionally with engineering, manufacturing, and suppliers to install, qualify, and improve tools and processes.

This position requires regular onsite presence to perform equipment oversight, installations, and hands-on process characterization.

Experience Level

Mid-level — typically 3–4+ years of relevant semiconductor or manufacturing experience in equipment/process control and process characterization.

Responsibilities

Key responsibilities include managing equipment and process performance across high-volume production lines and supporting factory ramps.

• Oversee critical high-volume manufacturing equipment and related module components.
• Perform tests and measurements to control critical dimensions and reduce defectivity.
• Implement equipment modifications to improve efficiency, quality, safety, and cost.
• Manage maintenance, repairs, upgrades, and tool matching/calibration activities.
• Lead equipment installation, conversion, qualification, and technology transfers during factory ramps.
• Drive continuous improvement focused on safety, quality, yield, cost, and defect reduction.
• Collaborate with equipment suppliers to resolve technical challenges and develop automation or tooling solutions.
• Develop systems for excursion prevention and discrepant material detection.

Requirements

Must-have skills and experience; see Education Requirements for degree details.

• 3–4+ years of hands-on experience with semiconductor equipment, equipment monitoring, and manufacturing process improvement.
• Experience with process characterization, manufacturing process change, and optical characterization.
• Experience leading equipment installation/qualification and supporting factory ramps.
• Strong analytical, problem-solving, and project coordination skills; ability to work with suppliers.
• Ability to work onsite regularly and support shift schedules as required.

Nice-to-have:

• Metrology fundamentals, tool matching/calibration, and process analytical metrology experience.
• Hands-on experience with packaging processes and semiconductor process flows, especially advanced packaging.
• Experience with experimental design, project management, and equipment automation development.

Education Requirements

Bachelor's (BS) degree in a STEM-related field or equivalent education is specified. The posting also references Master's and PhD as alternate qualification levels and allows equivalent practical experience in lieu of a degree.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.