Advanced Packaging Metro Module Engineer

Job Title

Advanced Packaging Metro Module Engineer

Role Summary

Support development and ramp-up of high-volume manufacturing processes for advanced packaging technologies (e.g., FOVEROS-S, EMIB). Own and optimize manufacturing equipment and processes to improve yield, quality, safety, and throughput. Collaborate with global teams, lead technology transfers, and work with equipment suppliers during factory ramps.

This role requires regular on-site presence and is not eligible for Intel immigration sponsorship.

Experience Level

Mid-level. Typical experience guideline from the posting: ~4 years with a Bachelor's degree, ~3 years with a Master’s, or no prior industry experience with a PhD.

Responsibilities

Key operational and engineering responsibilities supporting high-volume production.

• Oversee high-volume manufacturing equipment and processes for advanced integrated circuits and packaging.
• Perform tests and measurements to control critical dimensions and reduce defectivity.
• Implement equipment modifications to improve efficiency, quality, and cost.
• Manage maintenance, repairs, upgrades, and component lifecycle for equipment and modules.
• Lead equipment installation, conversion, and qualification during factory ramps.
• Drive continuous improvement focused on safety, quality, yield, and defect reduction.
• Collaborate with equipment suppliers to resolve technical issues and implement solutions.
• Develop systems for excursion prevention and discrepant material detection.
• Facilitate technology transfer through training, audits, and installation support.

Requirements

Minimum required technical skills and experience (degree details are summarized under Education Requirements).

• Experience with equipment monitoring and semiconductor equipment used in production environments.
• Experience in process characterization, manufacturing process improvement, and process change.
• Experience with optical characterization techniques in manufacturing.
• Demonstrated ability to lead equipment installation/qualification and collaborate with suppliers.
• Strong problem-solving skills and experience driving continuous improvement initiatives.

Nice-to-have:

• Hands-on metrology fundamentals, tool matching/calibration, and process analytical metrology.
• Familiarity with advanced packaging process flows and metrology assessment.
• Experience with experimental design, project management, and equipment automation development.

Education Requirements

Posting specifies a Bachelor's (BS) in a STEM-related field or equivalent education as a minimum. It also lists Master’s and PhD as alternatives with adjusted experience expectations: ~4 years of experience with a Bachelor's, ~3 years with a Master’s, or no required industry experience with a PhD. The posting allows equivalent practical experience in lieu of a degree.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.