Advanced Packaging Intern, MS - Summer 2027

Job Title

Advanced Packaging Intern, MS - Summer 2027

Role Summary

Join Marvell's Advanced Packaging team to perform electrical analysis and verification for advanced package and high-speed interconnect designs. The role focuses on signal integrity (SI), power integrity (PI), and electromagnetic (EM) simulation to ensure package and PCB electrical performance.

Work closely with package design, layout, hardware, and IP teams to optimize electrical performance for multi-chip and advanced packaging architectures. Position may require access to export-controlled technology; applicants must be eligible to access such information under applicable law.

Experience Level

Entry-level internship for a Master's candidate (internship).

Responsibilities

Primary tasks and deliverables for the internship:

• Perform SI, PI, and EM simulations for advanced packaging and high-speed interconnects.
• Evaluate package and PCB designs to verify electrical performance against requirements.
• Analyze power distribution networks (PDNs) and high-speed channels; identify and resolve signal and power delivery issues.
• Execute simulation and verification activities supporting SI/PI sign-off.
• Collaborate with package design, layout, hardware, and IP teams to improve electrical performance.
• Develop scripts and automation tools (e.g., Python, MATLAB) to improve analysis workflows.
• Document results and present technical findings to cross-functional engineering teams.

Requirements

Must-have technical skills and capabilities for an intern candidate (focused, hands-on learning expected):

• Strong understanding of electromagnetic fundamentals and signal integrity concepts.
• Experience or coursework in circuit simulation techniques and evaluating electrical behavior of package, PCB, or interconnect structures.
• Exposure to frequency-domain and time-domain analysis methodologies.
• Familiarity with electrical simulation tools for SI/PI/EM analysis.
• Ability to organize technical information, analyze data, document results, and communicate findings effectively.
• Collaborative team skills to work across disciplines and locations.

Nice-to-have:

• Hands-on exposure to 2-D/3-D EM tools (Ansys HFSS, SIwave, Cadence Clarity, or similar).
• Experience with PDN, channel analysis, or advanced packaging technologies (2.5D/3D).
• Familiarity with IC package design/layout tools (Cadence APD or equivalent).
• Proficiency in MATLAB, Python, or other scripting languages for automation.

Education Requirements

Currently enrolled in a Master's degree program in Electrical Engineering, Computer Engineering, or a related discipline, with expected graduation between Fall 2027 and Summer 2028. (PhD candidates were noted separately in the source as potentially eligible for additional compensation.)

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.