Advanced Packaging & Integration Lead
Equal1Job Title
Advanced Packaging & Integration Lead
Role Summary
Lead the R&D and architectural design of advanced packaging for multi-chip silicon spin-qubit devices within a scalable quantum system. Work with multidisciplinary teams and external partners to develop 3D-integrated solutions optimised for cryogenic operation.
Experience Level
Senior - typically requires 7+ years of relevant experience in 3D integration and advanced packaging.
Responsibilities
Accountable for strategy, design, simulation, and transfer of advanced packaging solutions into manufacturing.
- Define high-level strategy and architecture for 3D integrated circuits and multi-chip quantum modules.
- Design and develop packaging using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
- Ensure interconnects and packaging survive thermal cycling to millikelvin temperatures with reliable performance.
- Participate in early-stage architecture and co-design to ensure packaging scales with the quantum system.
- Develop and run DC and RF simulations for signal integrity, power integrity, thermal performance, and mechanical stress.
- Drive yield improvement, failure analysis, manufacturability, and long-term hardware reliability.
- Manage technical activities with external suppliers, OSATs, and research partners.
- Support transfer of novel packaging designs into external manufacturing and advanced packaging lines.
Requirements
Key technical skills and proven experience required; desirable skills listed separately.
- 7+ years' experience in 3D integration and advanced packaging, including TSVs, fine-pitch micro-bumps, and flip-chip bonding.
- Experience with 3D-IC layout, planning, and simulation platforms for multi-die co-design, TSV floorplanning, and vertical interconnect planning.
- Experience with multi-physics analysis tools (e.g., Ansys HFSS/Q3D or equivalent) for signal/power integrity, RF analysis, and cryogenic structural/thermal stress.
- Experience managing technical transfers and working with external semiconductor packaging facilities or OSATs.
- Proven ability to set technical strategy and collaborate across multidisciplinary engineering teams.
- Nice-to-have: experience with cryogenic electronics, semiconductor physics, or silicon spin qubits.
- Nice-to-have: knowledge of material behaviour at extreme temperatures, including superconductors and low-loss dielectrics.
- Nice-to-have: experience leading or mentoring engineers in fast-paced R&D settings.
Education Requirements
Master's or PhD in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field.
About the Company
Company: Equal1
Equal1 develops quantum hardware and control systems focused on spin-qubit processors, combining hardware and software engineering to advance scalable semiconductor-based quantum computing across international R&D sites.
