Advanced Packaging Integration and Simulation Intern
Intel CorporationJob Title
Advanced Packaging Integration and Simulation Intern
Role Summary
This internship supports research and development of advanced semiconductor packaging and 3D heterogeneous integration. The intern will work with researchers, process engineers, and modeling experts to develop package integration flows, build and validate simulation models, and analyze yield and reliability data.
Work focuses on package integration, process-flow development, physics-based simulation, and data-driven assessment for wafer-level and multi-die packaging technologies.
Experience Level
Entry-level internship (student). Candidates are expected to have at least several months of relevant academic or professional experience (see Requirements for details).
Responsibilities
Key responsibilities include hands-on support of integration activities, simulation and data analysis, and communication of technical results.
- Support wafer-level and package-level process flow development including 2.5D/3D integration, chiplet integration, and hybrid bonding modules.
- Design and execute experiments (DOE) to correlate package architecture, process conditions, materials, and electrical/mechanical performance.
- Build, calibrate, and apply simulation models to assess mechanical behavior, interconnect quality, and thermal performance.
- Perform thermo-mechanical simulations to evaluate material responses to temperature, stress, and package-level loading.
- Analyze inspection, process, and simulation data to identify root causes and recommend improvements.
- Collaborate with cross-functional teams to optimize flows for yield, reliability, manufacturability, and performance.
- Present technical findings in reviews, presentations, and potential publications.
Requirements
Minimum qualifications and preferred skills. Degree requirement is summarized under Education Requirements below and has been removed from this section.
- Must be available to work full-time for the duration of a 3-month internship.
- At least 3 months of academic or professional experience in one or more of: laboratory experimentation, engineering data analysis, or simulation/modeling workflows.
- Experience in process integration or hands-on module development.
- Programming or data-analysis experience with Python, MATLAB, JMP, R, or similar tools.
- Experience with statistical analysis, DOE, or machine learning applied to engineering problems.
- Preferred (nice-to-have): 6+ months experience in advanced packaging, heterogeneous integration, wafer-level packaging, chiplet integration, or package assembly process development.
- Preferred: thermal, mechanical, or electrical modeling and finite-element analysis; failure analysis for semiconductor process and package assembly.
Education Requirements
Candidate must be pursuing a PhD in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or a closely related STEM discipline.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
