Advanced Packaging Electrical / Signal Integrity Architect (f/m/d)

Job Title

Advanced Packaging Electrical / Signal Integrity Architect (f/m/d)

Role Summary

Lead electrical characterization and package-level signoff for advanced semiconductor packages, translating high-speed interconnect requirements into validated package architectures. Work closely with ASIC/SerDes designers, packaging architects, OSATs and system teams to ensure signal integrity, power integrity, and end-to-end channel performance meet product targets.

Experience Level

Mid-level — typically requires around 6+ years of relevant experience in package or PCB signal/power integrity, high-speed interconnects, or related hardware engineering roles.

Responsibilities

Deliver simulation-driven electrical co-design and signoff for 2.5D/3D, interposer, fan-out, and chiplet-based packages.

• Develop package-level equivalent circuit models (RLGC, S-parameters) and perform SI/PI, crosstalk, EMI/EMC analyses for high-speed channels.
• Define package stack-ups, substrate routing guidelines, via strategies, and bump-map/ball-out architectures from an electrical perspective.
• Build, validate, and correlate SI/PI and electromagnetic simulation models against laboratory measurements (VNA, TDR, high-speed scopes).
• Support chip-package-board co-simulation and end-to-end channel budgeting with ASIC, SerDes, and system teams.
• Partner with Advanced Packaging Architect, mechanical, thermal, manufacturing, and reliability teams to balance trade-offs.
• Collaborate with OSAT and foundry partners during development, qualification, and manufacturing to ensure manufacturability and DFM compliance.

Requirements

Key competencies and tools required or preferred for the role.

• 6+ years of experience in package or PCB SI/PI, power integrity, high-speed interconnect design, or related roles.
• Strong understanding of transmission line theory, electromagnetics, S-parameters, channel modeling, and package equivalent electrical model development.
• Hands-on experience with SI/PI and EM simulation tools (e.g., Ansys HFSS/SIwave, Cadence Sigrity, Keysight ADS, HSPICE) or equivalents.
• Experience validating and correlating simulation models with laboratory measurements (VNA, TDR, high-speed oscilloscopes).
• Practical knowledge of advanced packaging technologies: 2.5D/3D integration, interposers, fan-out packaging, chiplets, and high-density substrates.

• Scripting/automation experience (Python, Perl, Tcl, Cadence SKILL) for simulation workflows and data analysis.
• Experience with OSAT partners on package electrical qualification, manufacturing, or DFM activities.
• Experience with electrical/optical co-packaging, UCIe-class interconnects, or participation in standards bodies (IEEE, OIF, JEDEC).

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Physics, or a related technical field, or equivalent practical experience.

About the Company

Company: Black Semiconductor

Headquarters: Aachen, Germany

Black Semiconductor is revolutionizing the semiconductor industry with innovative graphene solutions that enhance chip connectivity and efficiency. By merging electronic computing and photonic communication, the company aims to reshape how chips interact, driving significant advancements in power and speed. Their human-centered approach fosters collaboration and continuous learning, making it a dynamic place for professionals to grow and make an impact.