Advanced Packaging Dry Etch Module Development Engineer

Job Title

Advanced Packaging Dry Etch Module Development Engineer

Role Summary

Responsible for developing, optimizing, and implementing plasma dry etch processes for advanced semiconductor packaging (2.5D/3D integration, chiplets, heterogeneous integration). Works on process development through transfer to manufacturing and partners with equipment suppliers and cross-functional teams to deliver scalable production solutions.

Experience Level

Mid-level. Typical experience guideline: Master's degree plus ~4 years relevant experience, or PhD plus ~2 years (see Education Requirements for details).

Responsibilities

Core responsibilities include process development, characterization, and transfer to production:

• Develop and optimize plasma etch processes for advanced packaging applications (2.5D/3D, chiplet, heterogeneous integration).
• Design and execute experiments (DOE) to characterize process windows and optimize etch performance.
• Define and execute technology roadmaps to meet future manufacturing and industry requirements.
• Partner with equipment suppliers to design, test, and implement process and equipment solutions.
• Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
• Identify and implement equipment or process modifications to improve performance and reduce costs.
• Collaborate cross-functionally with yield, operations, and engineering teams to develop robust, scalable manufacturing solutions.

Requirements

Must-have technical skills and experience required to perform the role. Education qualifications are summarized separately below.

• Process development engineering experience in semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
• Hands-on experience with plasma etch equipment platforms and process implementation.
• Experience designing and analyzing DOE, statistical process control, and process development methodology.
• Proven ability to monitor and improve production yield and manufacturing efficiency.
• Experience working with equipment suppliers and applying equipment modifications in production environments.
• Strong cross-functional collaboration and communication skills.

Nice-to-have:

• Demonstrated success leading programs from strategy through high-volume production.
• Technical leadership experience solving complex engineering challenges and driving industry-leading solutions.

Education Requirements

Master's or PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field. Hiring guideline: Master's degree with at least 4 years of relevant experience, or PhD with at least 2 years of relevant experience. "Related field" and equivalent practical experience are acceptable per the posting.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.