Advanced Packaging Design - SI/PI Engineer

Job Title

Advanced Packaging Design - SI/PI Engineer

Role Summary

Join Marvell's Advanced Packaging design team to perform signal and power integrity (SI/PI) analysis and optimization for multi-chip and advanced package designs. The team supports high-speed signaling, complex power-delivery networks, and emerging 3D and co-packaged optics packaging technologies.

This individual contributor role works with product, physical-design and IP teams and external manufacturers to deliver package designs that meet demanding electrical and integration requirements.

Experience Level

Mid-level - typically 3+ years of related professional experience in package or PCB design; candidates with equivalent experience are considered.

Responsibilities

Primary responsibilities include:

• Perform SI/PI analysis and optimization for 2D, 2.5D and 3D package designs.
• Interface with product and physical-design teams to define floor-planning, signal routing constraints, and power-delivery network requirements.
• Execute wiring/routing studies to determine optimal signal paths, verify power delivery, and size packages.
• Run circuit extraction and simulation tasks to support SI/PI sign-off.
• Collaborate with IP teams, external manufacturers, and cross-functional engineers to resolve electrical issues.
• Prepare technical documentation, presentations and design reviews.
• Work on-site five days per week at Marvell facilities in Westborough, MA or Chandler, AZ.

Requirements

Must-have and preferred qualifications:

• Must-have: Strong understanding of signal integrity and power integrity fundamentals and practical verification techniques.
• Must-have: Hands-on experience with SI/PI simulation and circuit extraction tools (examples: PowerSI, SIwave).
• Must-have: Experience evaluating package or PCB designs for challenging electrical requirements and performing design optimization for SI/PI.
• Must-have: Ability to collaborate across geographically distributed teams and communicate technical results clearly.
• Must-have: Ability to execute simulation tasks and deliver SI/PI sign-off artifacts and reports.
• Required: Eligibility to access export-controlled technology may be required; candidates may be subject to export-license review.
• Nice-to-have: Experience in package development (including interposer design) and familiarity with packaging technologies, substrate design rules and assembly processes.
• Nice-to-have: Experience with additional EDA and electromagnetic simulation tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity.

Education Requirements

BS in Electrical Engineering or a related technical field is expected. Alternatives accepted: MS with relevant experience or a completed PhD; equivalent practical experience will also be considered.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.