Advanced Packaging Design Engineer

Job Title

Advanced Packaging Design Engineer

Role Summary

Member of the Advanced Packaging team responsible for package design and technology development to meet electrical, mechanical, thermal and system requirements for high-performance computing (HPC), AI and networking solutions. Work focuses on multi-chip and multi-component packages including 2.5D/3D designs, interposers, advanced substrates and co-packaged copper/optics.

Collaborate with internal architecture, system and manufacturing teams and external foundry and substrate partners to deliver robust packaging solutions.

Experience Level

Mid-level — typically 5+ years of relevant professional experience in package or PCB design; candidates with a Master’s or PhD in Electrical Engineering and 3+ years of relevant experience are also appropriate.

Responsibilities

Primary responsibilities include:

• Develop package substrate and PCB layouts and generate advanced packaging solutions using substrate/PCB design tools.
• Perform floor-planning and routing of high-speed interfaces through package substrates and interposers.
• Design and integrate multi-chip configurations (2.5D/3D), co-packaged solutions, and advanced substrates with manufacturing partners.
• Apply SI/PI concepts and techniques to optimize signal routing and signal/power integrity.
• Collaborate across geographically distributed engineering teams and external suppliers.
• Prepare technical documentation, present findings, and provide technical leadership within projects.

Requirements

Must-have and preferred qualifications:

• Must-have: Practical experience in package substrate or PCB layout and routing for high-speed interfaces (HBM, DDR, SERDES, PCIe, Die-to-Die).
• Familiarity with semiconductor packaging technologies, materials, and substrate/PCB design methodologies.
• Working knowledge of signal integrity and power integrity concepts and mitigation techniques.
• Effective collaboration skills across locations, strong communication and documentation abilities, and demonstrated technical leadership.
• Preferred: Experience with substrate or PCB design tools such as APD or Xpedition; direct experience with 2.5D/3D packaging and co-packaged optics/copper.

Education Requirements

Bachelor's degree in Electrical Engineering or a related field with 5+ years of relevant professional experience; or a Master’s degree or PhD in Electrical Engineering with 3+ years of relevant professional experience.

About the Company

Company: Marvell Technology

Headquarters: Santa Clara, California, United States

Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.