Advanced Package Technology Principal Engineer

Job Title

Advanced Package Technology Principal Engineer

Role Summary

Lead mechanical FEA and thermo‑mechanical reliability analysis for advanced IC and multi‑chip package architectures that enable Lumilens' high‑speed photonic engines. Work within a distributed R&D organization and partner with design, manufacturing, reliability, and vendor teams to influence package and ASIC mechanical design from concept through production.

This role focuses on hands‑on simulation, model calibration with empirical data, and lab validation to drive robust, scalable packaging solutions for AI, HPC, and networking systems.

Experience Level

Senior. See Education Requirements for specific years-of-experience guidance tied to degree level.

Responsibilities

Primary responsibilities include simulation, analysis, experiment design, and cross‑functional alignment to mitigate mechanical and reliability risks in advanced packaging.

• Perform FEA simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability across flip‑chip, fan‑out, 2.5D/3D IC, chiplet, and MCM architectures.
• Define simulation requirements, analyze results, and provide actionable design and process recommendations to R&D and manufacturing teams.
• Support technology roadmapping by assessing new materials, interconnect structures, and process flows from a thermo‑mechanical reliability perspective.
• Lead design-of-experiments (DOE) and sensitivity analyses to identify key reliability and performance drivers.
• Develop and run lab‑level experiments and metrology to validate simulations, calibrate models, and identify root causes.
• Collaborate across photonics, ASIC design, manufacturing, reliability, and external vendors to ensure scalable package architectures.

Requirements

Must-have technical skills and capabilities.

• Deep expertise in advanced packaging technologies and architectures (flip‑chip, fan‑out/WLCSP, 2.5D/3D integration, chiplets, TSVs, MCMs).
• Strong understanding of material behavior for polymers, metals, ceramics and their thermo‑mechanical interactions.
• Familiarity with semiconductor packaging processes: die attach, underfill, molding, bumping, reflow.
• Proficiency with FEA tools such as Ansys Classic/Mechanical and Abaqus; ability to set up models and interpret results using first‑principles mechanics.
• Experience calibrating simulation models with empirical data and performing hands‑on mechanical testing and metrology.
• Proven track record of designing lab experiments to validate simulations and drive root‑cause analysis.
• Good judgment balancing manufacturing constraints, reliability requirements, cost, and performance.
• Effective communication, presentation, and technical documentation skills; experience collaborating with global, cross‑functional teams and vendors.

Education Requirements

Bachelor's degree in Mechanical Engineering or a related field with 12+ years of FEA experience; Master's degree with 10+ years; or PhD with 7+ years. (Source specifies degree level and corresponding minimum years of FEA experience.)

About the Company

Company: Lumilens

Headquarters: San Jose, CA, USA

Lumilens develops integrated photonics and optical interconnect solutions for high-speed data communication and chip-to-chip interfaces, focusing on optical front-end hardware and co-packaged optics for advanced semiconductor systems.