Advanced Package Technology Engineer
BroadcomJob Title
Advanced Package Technology Engineer
Role Summary
Member of the Worldwide ASIC Product Development team responsible for leading development of advanced custom 2.5D/3D packaging solutions. Collaborates with silicon and package design, marketing, NPI, assembly/substrate suppliers, and customers to deliver cost-effective, high-performance packages that meet signal integrity, thermal, reliability, design rule, and schedule requirements.
Experience Level
Senior-level role. The posting specifies 10+ years of relevant experience and expects extensive hands-on experience in advanced packaging technologies.
Responsibilities
Primary duties include technical leadership, program management, cross-functional coordination, and support for NPI and manufacturing ramps.
- Lead technology definition and act as subject-matter expert in 2.5D and 3D advanced packaging and heterogeneous integration.
- Engage with customers to consolidate requirements and translate needs into unified packaging solutions.
- Identify, develop, and qualify advanced packaging solutions; manage programs with external assembly, substrate, and memory partners.
- Coordinate with internal teams (Design Integration, Package Design, Test Development) to ensure design-for-manufacturing and testability.
- Support new design wins, New Product Introduction (NPI), high-volume manufacturing ramps, alternate sourcing, and supplier qualification.
- Drive BOM definition, supplier evaluation, and qualification activities related to materials and processes.
Requirements
Must-have technical skills, experience, and competencies.
- 10+ years of relevant industry experience (senior-level responsibility and ownership of packaging programs).
- 6+ years hands-on experience in 2.5D/3D package development and heterogeneous integration.
- Experience with large, complex, fine-pitch flip-chip solutions, multi-layer ceramic/organic substrates, interposers, and wafer-level packaging.
- In-depth knowledge of silicon bumping, interposer, substrate, assembly processes, materials selection, and thermal-mechanical interactions.
- Proficiency with thermal and mechanical modeling tools and substrate/PCB CAD tools (examples: APD, AutoCAD, SolidWorks) for design optimization.
- Practical understanding of advanced-node silicon fabrication, PCB technologies, failure analysis, and industry quality systems.
- Strong project management, analytical, problem-solving, and interpersonal skills; ability to manage multiple programs concurrently.
- Excellent communication skills for global collaboration; periodic travel may be required.
Education Requirements
Ph.D. or Master’s degree in Mechanical, Electrical, or Electronics Engineering. The posting pairs these degree requirements with senior experience expectations (10+ years).
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
