Advance Packaging Process Development Engineer

Job Title

Advance Packaging Process Development Engineer

Role Summary

The engineer will develop, configure and optimize package assembly processes (front end, bonding and back end) to support memory product ramp-up and qualification. The role works closely with manufacturing and global design teams to certify processes, define assembly guidelines, and approve material/process/equipment changes.

Experience Level

Entry-level (0–2 years of relevant experience in semiconductor manufacturing or related fields).

Responsibilities

Key responsibilities include process development, hands-on testing, and cross-functional transfer to manufacturing.

• Develop, configure, and optimize assembly and wafer-level packaging processes to meet product and yield targets.
• Perform side-by-side certification and transfer activities with manufacturing teams.
• Collect, analyze, and interpret process data; identify root causes and implement corrective actions.
• Define and document assembly process guidelines and work with global design teams on requirements.
• Run, test, and upgrade equipment and process flows; participate in change control board (CCB) approvals for materials, processes, and equipment.
• Assess process capability and risks for bumping, TSV, and other advanced packaging technologies.
• Collaborate with cross-functional and global teams across time zones to support product ramps.
• Apply role-appropriate AI-assisted tools and digital methods to improve process efficiency and analysis.

Requirements

Must-have technical skills and attributes are listed first; nice-to-have items follow.

• Must-have: Hands-on experience in semiconductor packaging or frontend processes; strong analytical and troubleshooting skills; effective verbal and written communication; ability to work in a fast-paced, global environment; collaborative team orientation.
• Must-have technical areas: experience with process development, data-driven process control, and capability assessment.
• Nice-to-have: Familiarity with High Bandwidth Memory (HBM) integration; experience or exposure to Thermo-Compression Bonding (TCB), Chemical Mechanical Planarization (CMP), flip chip, underfill, wafer-level molding, ball mount, hybrid bond, glass carrier bond/de-bond.
• Preferred digital skills: baseline digital fluency and the ability to use AI-enabled tools responsibly for research, analysis, and process improvements.

Education Requirements

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or a related field is expected; Master's or PhD preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.