ADCE Packaging Design Architect

Job Title

ADCE Packaging Design Architect

Role Summary

Drive end-to-end substrate and package design from concept through tape-out, including physical layout, routing, and design-rule definition. Collaborate with silicon, hardware, and manufacturing teams to optimize silicon-package-board performance and pinout and to deliver designs and documentation into the product lifecycle management system.

This role requires on-site presence and is a Position of Trust subject to an extended background investigation.

Experience Level

Senior-level — requires 10+ years of relevant experience in package, PCB, or IC design.

Responsibilities

Key responsibilities include:

• Lead substrate/package layout and routing from concept through tape-out.
• Perform substrate fit and routing studies to evaluate design, performance, and cost trade-offs.
• Define substrate design rules and resolve DRCs.
• Run electrical and electromagnetic simulations and analyze results to iterate designs.
• Collaborate with silicon, hardware, and manufacturing teams to optimize pinout and signal/integrity performance.
• Coordinate internal and external design reviews and deliver documentation into PLM.

Requirements

Must-have skills and experience:

• Strong technical background in package design and electrical analysis.
• Solid knowledge of semiconductor fabrication and packaging processes.
• Experience with design and electromagnetic simulation tools such as Mentor, Cadence, SPICE, and Ansys.
• Experience with Cadence Allegro platform (Advanced Package Designer, APD/SiP, PCB Editor) and/or Mentor Xpedition platform (PCB Layout, Designer, Hyperlynx).
• Strong analytical, debugging, and problem-solving skills; ability to work independently at multiple abstraction levels.
• Strong organization, time management, and communication skills.

Nice-to-have:

• Knowledge of assembly process, test, and characterization techniques.
• Experience in PCB/packaging test flow and manufacturing handoff.

Education Requirements

Ph.D. or Master’s degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, or Materials Science specified in the posting.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.