3D-IC Application Engineer

Job Title

3D-IC Application Engineer

Role Summary

As an Applications Engineer in Siemens EDA Technology Solutions Sales, you will support consultative sales to semiconductor and electronic equipment manufacturers across the United States. The primary mission is to secure technical design wins for Siemens EDA products (Innovator 3D IC Layout/Integrator, Xpedition, Calibre, HyperLynx) and to prototype 3DIC solutions by developing flows and integration scripts.

This is a hybrid role based in Austin, TX, requiring collaboration with global teams and occasional international travel.

Experience Level

Mid-level — the posting specifies approximately 4+ years of design experience.

Responsibilities

The role combines technical sales support, solution architecture, and tooling integration.

• Lead technical presentations, product demonstrations, and benchmark evaluations to secure design wins.
• Develop and prototype 3DIC flows and integration scripts to link Siemens EDA tools into customer solutions.
• Implement package/interposer layout flows from design setup through manufacturing deliverables.
• Collaborate with global peers and account teams to define account strategies and communicate status to stakeholders.
• Support pre-sales activities including technical consulting, solution definition, and proposals.
• Travel domestically and internationally as required to support key accounts.

Requirements

Must-have technical skills and experience:

• Significant experience in advanced IC package layout and/or interposer layout.
• Practical experience with package design workflows: stackup, constraints, routing, reuse, and generation of manufacturing documents.
• Knowledge of IC package design tools (Cadence APD/SiP or Siemens Xpedition/i3DL).
• Proficiency with scripting/programming (Python, Tcl, VBS, Perl, or similar).
• Working knowledge of Windows and Linux environments.
• Proficiency with Microsoft Word, Excel, and PowerPoint.
• Strong communication skills and ability to influence technical and business stakeholders.

Nice-to-have:

• Familiarity with package/interposer planning tools (XSI/i3DI, OrbitIO/ISP, Synopsys 3DIC Compiler).
• Experience with 2.5D/3D chiplet-based solutions (InFO, CoWoS, EMIB, Foveros, etc.).
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS).
• Familiarity with signal and power integrity tools (HyperLynx, Sigrity, SIWave, ADS).
• Experience with Siemens Calibre DRC/LVS/3DSTACK solutions.
• Prior Applications Engineer experience.

Education Requirements

MSEE or BSEE is specified; the posting states "MSEE/BSEE with 4+ years design experience."

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.