2027 Undergrad ASIC Package Engineering Co-op/Intern

Job Title

2027 Undergrad ASIC Package Engineering Co-op/Intern

Role Summary

Join AMD's ASIC Package Engineering team to support package design and development for AMD products and test vehicles. Work directly with engineers on substrate, interposer and bump designs, design verification, yield analysis, and materials evaluation.

This is a full-time (40 hours/week) co-op/internship performed in either an onsite or hybrid structure at one of AMD's U.S. sites. Several term options are available (spring, summer, summer-fall) with specific start/end dates per academic calendar.

Experience Level

Entry-level intern/co-op for undergraduate students (undergraduate degree program). This is a temporary student position.

Responsibilities

Key responsibilities during the co-op/intern term:

• Support package design and package development engineers in project prioritization and optimization.
• Perform substrate, interposer and bump designs for products, test vehicles and probe card substrates under guidance.
• Implement and support design verification activities to validate performance and quality.
• Analyze yield and defect metrics and contribute to yield-improvement activities.
• Evaluate and benchmark packaging materials and collaborate with external partners to meet cost, performance and yield goals.
• Complete assigned project tasks, documentation, and report results to engineering leads.

Requirements

Basic eligibility and technical expectations. Degree specifics are in Education Requirements below.

• Available to work full time (40 hours/week) for the selected co-op/intern term and able to work onsite or in a hybrid model at a U.S. AMD site.
• This role is not eligible for visa sponsorship; U.S.-based enrollment and work authorization expected.
• Familiarity with semiconductor packaging concepts, packaging processes, or semiconductor theory.
• Experience with package, silicon or PCB design tools is beneficial.
• Proficiency or coursework with scripting languages (Perl, Python, SQL) is useful for data processing and automation.
• Experience with data analytics and visualization tools (for example Power BI) is a plus.

Education Requirements

Currently enrolled in a U.S.-based university undergraduate Bachelor's degree program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Materials Science Engineering, or a related engineering/technical field. Enrollment as an undergraduate student is required for co-op/intern eligibility.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.