2027 Masters ASIC Package Engineering Co-op/Intern

Job Title

2027 Masters ASIC Package Engineering Co-op/Intern

Role Summary

Full-time (40 hours/week) co-op or internship supporting ASIC package design and development across AMD packaging teams. Work will involve hands-on design tasks, verification, yield analysis, and materials evaluation to support substrate, interposer and bump designs for AMD products and test vehicles.

Positions are onsite or hybrid at multiple U.S. locations for defined co-op/intern terms (spring, summer, summer-fall as specified by academic calendar).

Experience Level

Entry-level (student intern/co-op). This is an internship/co-op role intended for students; no prior professional experience required.

Responsibilities

Typical responsibilities for the role include:

• Support package design and package development engineers in prioritizing and optimizing projects.
• Complete substrate, interposer and bump designs for products, test vehicles, and probe card substrates under guidance.
• Perform design verification tasks to validate performance, quality, and efficiency of package designs.
• Analyze yield and defect metrics and recommend design or process improvements.
• Evaluate and benchmark packaging materials and interact with suppliers and partners to balance cost, performance, and yield.
• Develop and run scripts or automation to support design and verification workflows as needed.

Requirements

Must-have and relevant skills for a successful candidate.

• Available to work full time (40 hours/week) during the co-op/intern term; able to work onsite or in a hybrid schedule.
• Familiarity with transmission lines, electric circuits, semiconductor packaging processes, or related coursework.
• Experience with package, silicon or PCB design software (academic or practical exposure acceptable).
• Basic scripting ability (Perl, Python, SQL) for data analysis or automation tasks.
• Experience or interest in data analytics and visualization tools (for example Power BI).
• Strong analytical and problem-solving skills; ability to work with cross-functional teams and external partners.
• This role is not eligible for visa sponsorship; candidates must meet work-authorization requirements.

Education Requirements

Enrollment in a U.S.-based Master's degree program in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Materials Science Engineering, or a related technical field. (The posting specifically targets Master's students for this co-op/intern position.)

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.