2027 Master's ASIC Package Engineering Co-op/Intern

Job Title

2027 Master's ASIC Package Engineering Co-op/Intern

Role Summary

Internship on the ASIC Package Engineering team working on substrate, interposer, and bump designs for AMD products, test vehicles and probe card substrates. The role supports package design and development engineers to prioritize and optimize projects, verify implementations, and improve yield.

This is a full-time (40 hours/week) co-op/intern position based in San Jose or Santa Clara with an onsite or hybrid work structure during the term.

Experience Level

Intern / Co-op — Master's student level. This role is intended for currently enrolled graduate students; prior industry experience is helpful but not required.

Responsibilities

Typical responsibilities during the co-op/intern term include:

• Support package design and package development engineers in project prioritization and optimization.
• Complete substrate, interposer and bump designs for products, test vehicles, and probe card substrates.
• Perform design verification tasks to ensure performance, quality, and efficiency.
• Analyze yield and defect metrics and recommend design or process improvements.
• Evaluate and benchmark packaging materials and collaborate with external partners to balance cost, performance, and yield.
• Document results and present findings to engineering team members.

Requirements

Key technical skills and conditions expected for successful candidates:

• Coursework or familiarity with transmission lines and electric circuits.
• Experience or coursework with package, silicon or PCB design software.
• Basic scripting skills (Perl, Python, SQL) for automation and data handling.
• Understanding of semiconductor theory and packaging process/technology.
• Experience with data analytics and visualization tools (example: Power BI) is helpful.
• Able to work full-time (40 hours/week) for the duration of the assigned co-op/intern term.
• This role is not eligible for visa sponsorship.

Education Requirements

Currently enrolled in a U.S.-based Master’s degree program in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Materials Science Engineering, or a related technical field.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.