Yield Development Engineer

Job Title

Yield Development Engineer

Role Summary

Lead yield improvement efforts for Advanced Packaging Technology and Manufacturing (APTM). Work with process, integration, and cross-functional teams to apply data-driven analytics and model-based problem solving that improve manufacturing yield for advanced packaging technologies.

Analyze manufacturing data from inline tools, metrology imaging, electrical tests, and lab characterization to identify root causes and implement corrective and preventive actions that improve production performance.

Experience Level

Mid-level — Experienced hire. Typical background: Bachelor's degree plus ~4 years of relevant experience, or a Master's/Ph.D. in a relevant technical field.

Responsibilities

Key responsibilities include:

• Define and lead yield improvement roadmaps and projects; prioritize actions and measure results.
• Analyze diverse manufacturing datasets (inline tool telemetry, metrology images, electrical test data, lab characterization) to identify patterns and root causes.
• Develop and apply statistical and machine-learning models; perform hypothesis-driven model-based problem solving.
• Monitor real-time yield metrics, respond to daily yield loss events, and implement corrective and preventive measures.
• Prepare and present clear yield reports and recommendations to stakeholders and leadership.
• Collaborate with process modules, integration teams, and other stakeholders to implement yield actions.

Requirements

Summary of required and preferred skills and experience.

• Must-have: Practical experience in data analytics using Python and/or JMP; proficiency with core data-science libraries such as NumPy, Pandas, SciPy, Matplotlib, scikit-learn, TensorFlow or PyTorch.
• Must-have: Strong problem-solving skills and experience applying model-based, hypothesis-driven analysis in a manufacturing or process environment.
• Nice-to-have: Knowledge of process fundamentals, tool behaviors, and underlying physics relevant to semiconductor packaging.
• Nice-to-have: Experience in wafer-level and/or package assembly operations, familiarity with process flows and manufacturing tools.
• Nice-to-have: Cross-functional leadership and strong communication skills; ability to work independently in fast-paced environments.

Education Requirements

Advanced technical degree required: Bachelor's degree with approximately 4 years of relevant experience, or a Master's or Ph.D. in Physics, Mechanical Engineering, Materials Science, Electrical Engineering, Chemistry, or a related engineering/technical discipline.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.