Wire Bond Manufacturing Engineer

Job Title

Wire Bond Manufacturing Engineer

Role Summary

Join the Manufacturing Engineering team (Semiconductor Assembly & Test) to develop, qualify, optimize, and sustain wire-bonding processes and equipment for semiconductor packaging. The role focuses on achieving high yield, reliability, and throughput for ball, wedge, and ribbon bonding while supporting new product introduction and continuous improvement.

Experience Level

Mid-level (3–7 years of relevant experience). The posting describes the role as mid-to-senior, with hands-on wire bond process/equipment experience expected.

Responsibilities

Deliver, qualify, and sustain wire bond processes and equipment; ensure yield, reliability, and production throughput while supporting NPI and cross-functional problem solving.

• Develop and optimize thermosonic ball, wedge, and ribbon bond processes for gold, copper, and aluminum wire; establish bond recipes, work instructions, and control plans.
• Lead root cause analysis and CAPA for yield losses and defects; perform DOE-driven process windows, wire pull, and ball shear testing against JEDEC/MIL-STD-883.
• Manage uptime, throughput, and performance of wire bonding equipment (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond); troubleshoot equipment issues and optimize cycle time/UPH.
• Lead equipment qualification, installation, and IQ/OQ/PQ for new or upgraded bonders and coordinate technical escalations with vendors.
• Partner with Quality and Reliability on failure analysis, qualification builds, reliability testing (temp cycle, HTOL, HAST), and customer submissions.
• Collaborate with Product/Design, Process Integration, and Test to resolve yield and reliability issues and support cost-reduction initiatives.
• Maintain process control documents, FMEAs, control plans, and traceability per ISO 9001 / IATF 16949 / AS9100; support audits and operator training.

Requirements

Must-have and preferred qualifications for successful candidates. Degree and certification details are summarized in the Education Requirements section below and are not duplicated here.

• Must-have: 3–7 years hands-on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM).
• Must-have: Practical knowledge of ball, wedge, and/or ribbon bonding processes and common failure modes.
• Must-have: Experience with DOE, SPC/statistical process control, and structured root cause/CAPA methods.
• Must-have: Familiarity with wire bond equipment platforms and reliability testing standards (JEDEC, MIL-STD-883).
• Must-have: Strong analytical and troubleshooting skills, effective cross-functional communication, and willingness to support shift or production floor needs.
• Nice-to-have: Experience in high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging; copper wire bonding and fine-pitch (<50 µm) or multi-tier/stacked die bonding.
• Nice-to-have: Familiarity with Minitab/JMP, MES/data systems, AOI/vision systems, and cleanroom manufacturing.

Education Requirements

Bachelor's degree in Electrical, Mechanical, Materials Science, or a related engineering field is required. Preferred certifications mentioned include Six Sigma Green or Black Belt. No explicit alternative "equivalent practical experience" language was provided in the posting.

About the Company

Company: Lumilens

Headquarters: San Jose, CA, USA

Lumilens develops integrated photonics and optical interconnect solutions for high-speed data communication and chip-to-chip interfaces, focusing on optical front-end hardware and co-packaged optics for advanced semiconductor systems.