Wafer Sort / Final Test Thermal-Mechanical Hardware Development Engineer Intern
Internship role on the Wafer Sort/Final Test mechanical hardware development team. Work with engineers on thermal/mechanical hardware design, BOM generation, and ATE (automatic test equipment) mechanical change implementations for wafer sort and final test.
Expect hands-on engineering tasks, participation in design reviews, and collaboration with test and manufacturing partners to meet company standards.
Entry-level internship for current students. The posting targets university students based in Singapore. Internship period: starts 4 Jan 2027 and ends 28 May 2027, with an optional extension concluding 6 Aug 2027.
Typical responsibilities for this internship include:
Must-have technical skills and attributes for the role:
Current university students based in Singapore. Degree fields mentioned: Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering, or Data Science with engineering interest. The posting also references both undergraduate and PhD students as potential interns.
Company: Advanced Micro Devices
Headquarters: Sunnyvale, California, USA
Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.
