Wafer Assembly TD Strategic Program Manager

Job Title

Wafer Assembly TD Strategic Program Manager

Role Summary

As a Strategic Program Leader in Wafer Level Assembly Technology Development (TD), you will lead development and enablement of advanced manufacturing processes, translating concepts into scalable factory solutions. You will work with cross-functional teams, suppliers, and factory operations to define manufacturability, build capacity strategies, and deliver process technologies for future nodes.

This role requires on-site presence at the Hillsboro, OR facility and contributes directly to process technology roadmaps and manufacturing readiness.

Experience Level

Senior — requires significant industry experience. Guidance: 12 years with a Bachelor's, 8 years with a Master's, or 6 years with a PhD.

Responsibilities

Primary responsibilities include process development, manufacturability, and factory enablement for future technology nodes.

• Lead design and development of advanced manufacturing processes and capacity/space planning for wafer assembly.
• Define manufacturability and functional requirements for device architectures and process flows.
• Perform simulations and engineering feasibility studies to assess process capabilities.
• Partner with equipment and materials suppliers to implement enabling technologies.
• Recommend modifications to equipment and factory infrastructure to improve efficiency and output.
• Monitor industry process and material trends to inform cost-effective technology roadmaps.
• Create and maintain technical documentation and standards for process characterization and improvement.
• Conduct pathfinding activities to establish technologies that support future device designs.

Requirements

Must-have technical skills and workplace requirements.

• Proven expertise in manufacturability, process development, and process improvement in a high-tech manufacturing environment.
• Advanced proficiency in process characterization, technical documentation, and systematic problem solving.
• Experience designing and optimizing processes, including materials selection and parameter optimization.
• Strong communication skills and ability to collaborate across multidisciplinary teams.
• Ability to work on-site in Hillsboro, OR.
• Ability to pass an extended background investigation and required security checks (Position of Trust).

Nice-to-have:

• Experience leading cross-functional projects and managing supplier partnerships.
• Knowledge of emerging industrial trends and vendor ecosystem coordination.
• Experience developing cost-sensitive technology roadmaps.

Education Requirements

Bachelor's/BS in Engineering, Materials Science, Physics, Chemistry, or a related technical field, or equivalent practical experience. Experience guideline provided by employer: 12 years with a Bachelor's degree; 8 years with a Master's degree; 6 years with a PhD.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.