Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging

Job Title

Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging

Role Summary

Work on thermal, mechanical, and materials engineering for Annapurna Labs' semiconductor packages used in data-center servers. The role focuses on evaluation, modeling, testing, and optimization of package and system architectures to meet reliability, thermal, and mechanical requirements at scale.

You'll collaborate with Package Design, Test, Quality & Reliability, and System teams to quantify risks, validate designs with experiments, and drive data-driven package decisions.

Experience Level

Mid-level - requires 5+ years industry experience in mechanical design for semiconductor systems and 3+ years in advanced packaging.

Responsibilities

Accountabilities include simulation, experimentation, cross-team technical coordination, and documentation to support package design and reliability.

• Perform finite element (FEA) and analytical simulations to evaluate assembly, test, and reliability risks for advanced semiconductor packages.
• Design and execute lab experiments on materials, package stacks, and system structures to validate performance and inform design decisions.
• Develop risk evaluations and provide data-driven recommendations shaping next-generation package designs.
• Collaborate with Quality & Reliability, Package Design, Test, and System teams to resolve cross-functional technical issues.
• Correlate simulation models with experimental data, iterate models and designs, and present findings in documentation and design reviews.

Requirements

Must-have technical skills and experience; preferred items listed separately.

Must-have:

• 5+ years industry experience in mechanical design of semiconductor-based systems (silicon, packaging, system).
• 3+ years industry experience in advanced semiconductor packaging and in designing/testing test vehicles for future packaging architectures.
• Experience evaluating properties of next-generation materials and optimizing package architectures for quality, performance, and cost.
• Experience working with packaging component vendors, ODMs, and internal design teams to triage and resolve cross-boundary issues.
• Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPAK, or equivalent FEA/CFD software.

Nice-to-have / Preferred:

• Hands-on experience with lab thermal and mechanical measurements (infrared thermography, stress/strain gauges, power measurement, acoustic chambers, thermal test setups).
• Experience developing CFD and compact RC thermal models and correlating them with experimental data.
• Knowledge of heatsink solutions, TIMs, liquid cooling (cold plates), fans, manifolds, and CDU technologies.
• Experience designing custom test fixtures, data acquisition systems, DOE, Six Sigma methodologies, and performing root-cause failure analysis.
• Familiarity with hardware/software thermal and power management control algorithms and product development lifecycle through high-volume manufacturing.

Education Requirements

Bachelor's degree in Mechanical Engineering or equivalent practical experience. The posting allows "or equivalent" practical experience in lieu of a degree. Preferred qualifications mention domain knowledge and methodologies (e.g., Six Sigma) but do not mandate specific certifications.

About the Company

Company: Amazon

Headquarters: Seattle, Washington, United States

Amazon is a global leader in e-commerce and cloud computing, committed to delivering fast, reliable services across diverse sectors. The company's innovative technologies include AWS, Kindle, and Echo, as well as developing low Earth orbit satellite networks for improved internet connectivity worldwide.