Thermal Analysis Engineer

Job Title

Thermal Analysis Engineer

Role Summary

Work in Intel's Thermal Core Comp organization to design, simulate, and prototype packaging, interconnect and device solutions that address thermal, thermomechanical and electrical challenges for advanced semiconductor platforms. The role combines hands-on experimentation, simulation, and cross-functional collaboration to advance assembly and packaging technologies.

Experience Level

Mid-level. See Education Requirements for the specific years-of-experience guidance associated with academic credentials.

Responsibilities

Primary responsibilities include conducting research, building prototypes, characterizing devices, and developing processes and models to advance packaging and interconnect technologies.

• Conduct research using device physics, thermomechanical analysis, and materials science to enable novel devices and systems.
• Design and fabricate prototypes to demonstrate proof-of-concept packaging and interconnect technologies.
• Perform electrical testing and device characterization (DC, RF analysis, pulsing, stressing).
• Develop and optimize process solutions across lithography, etch, diffusion, CVD, PVD, CMP and packaging modules.
• Plan and execute experiments with device, reliability, and fabrication teams and benchmark results to standards.
• Develop models and measurement methods to improve understanding of device physics, packaging, and system-level behavior.
• Engage with external vendors and researchers to support collaborations and research pipeline.

Requirements

Must-have technical skills and experience for initial consideration; listed as concise must-have vs nice-to-have items.

• Must-have: Advanced experience with semiconductor fabrication and packaging processes (lithography, etch, diffusion, packaging design).
• Must-have: Experience with simulation and analysis tools such as Ansys or Abaqus for finite element analysis and CFD.
• Must-have: Proficiency in programming for engineering applications (Python or MATLAB).
• Must-have: Hands-on lab experience with experimental setups and data analysis for electrical and thermal testing.
• Must-have: Experience with advanced packaging technologies (examples: EMIB, Foveros) and design-for-reliability methods.
• Must-have: Knowledge of Design of Experiments (DOE), statistical analysis, and model-based problem solving.
• Nice-to-have: Familiarity with materials characterization techniques and collaboration with external research partners.
• Nice-to-have: Proven ability to lead and influence technical teams, present findings, and mentor junior engineers.

Education Requirements

Bachelor's (BS) in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field is listed. Experience equivalencies provided: 6+ years of experience with a bachelor’s degree, 4+ years with a master’s degree, or 2+ years with a PhD. No specific certifications were listed. "Related field" and the experience equivalencies indicate that equivalent practical experience may be acceptable.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.