Job Title
Test Development Engineer
Role Summary
Lead design, development, and enablement of manufacturing test processes, tooling, equipment, and hardware solutions for advanced packaging and semiconductor test technologies. Work with cross-functional teams (process integration, hardware, suppliers) to develop and validate test solutions that support wafer probing, die/package testing, and advanced packaging technologies.
This role focuses on applied R&D, feasibility studies, and production enablement to improve yield, throughput, and test capabilities.
Experience Level
Senior-level. This role requires substantial industry experience and technical leadership; see Education Requirements for degree-and-years guidance.
Responsibilities
Primary responsibilities include development, validation, and transfer of test manufacturing solutions and collaborating across functions and vendors.
- Lead design and development of test manufacturing processes, material selection, tooling, equipment, and system design.
- Plan and execute feasibility studies using simulation and experimental methods.
- Perform pathfinding and prototyping to explore new process and hardware solutions for future test needs.
- Modify and optimize equipment and processes to improve efficiency, yield, and production output.
- Collaborate with equipment and materials suppliers to develop enabling technologies and align solutions with roadmap requirements.
- Monitor industry trends and develop strategies to address future test technology needs.
- Apply Design of Experiments (DOE) and statistical analysis to guide process development and engineering decisions.
- Drive disciplined execution of R&D projects and facilitate group problem solving to resolve technical challenges.
Requirements
Must-have technical skills and experience; preferred items listed separately.
- Hands-on experience with analog/mixed-signal testing, circuit testing, or electrical characterization techniques.
- Experience applying Design of Experiments (DOE), statistical process control, and data analysis to development work.
- Mechanical design and mechanical test experience, including test tool development and maintenance.
- Experience with manufacturing process improvement and resolving complex engineering problems in production environments.
- Development or manufacturing experience in wafer probing, die probing, package testing, reliability stress/screens, or substrate testing.
- Ability to run feasibility studies, simulations, and pathfinding activities to validate concepts.
- Proven ability to work with external vendors and cross-functional teams to implement process solutions.
- Strong communication, collaboration, and problem-solving skills.
Nice-to-have:
- Advanced knowledge of emerging materials and process technologies in semiconductor manufacturing.
- Experience leading cross-functional teams on complex process enablement projects.
Education Requirements
Required: Bachelor's degree with 9+ years of related experience, OR Master’s degree with 6+ years of related experience, OR PhD with 4+ years of related experience in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical/specialized field. Equivalent practical experience is not specified. (This position is not eligible for immigration sponsorship.)
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Date Posted: 2026-05-15