Technical Program Manager — System in Package (Semiconductor Packaging Operations)
AppleJob Title
Technical Program Manager — System in Package (Semiconductor Packaging Operations)
Role Summary
As Technical Program Manager for system-in-package semiconductor packaging operations, you will own factory output, yield, quality, and volume-ramp readiness. You will lead cross-functional teams and partner with contract manufacturers and New Product Introduction to deliver high-volume products on schedule.
Experience Level
Senior-level. Specific years of experience are not stated; the role expects demonstrated program leadership in manufacturing operations and yield management.
Responsibilities
Accountabilities include manufacturing readiness, yield, quality, and supplier performance.
- Own end-to-end factory output, yield, quality, and readiness for volume ramp.
- Drive yield improvement and operational excellence with manufacturing partners.
- Identify and close issues prior to mass production and integrate lessons learned into future designs.
- Apply predictive, data-driven methods to anticipate and resolve quality issues.
- Track partner performance via objective measurements, audits, and online verification; implement corrective actions.
- Deliver executive-level status reports on a weekly cadence and escalate major concerns to senior management.
Requirements
Must-have skills and experience; preferred items listed separately.
- Experience in high-volume consumer-electronics manufacturing, including SMT and packaging processes.
- Operations management experience, including yield improvement and OEE optimization.
- Working knowledge of quality-control methodologies: SPC, MSA, GRR, FMEA.
- Program or project management experience with ability to translate high-level goals into actionable plans.
- Experience operating within a matrix organization and leading cross-functional, cross-cultural teams.
- Excellent written and spoken English communication skills.
Nice-to-have:
- Technical expertise in PCBA, molding, laser processing, sputtering, assembly, test, and pack-out processes.
- Hands-on experience with design of experiments (DOE) and failure analysis (FA); familiarity with automation and DFM for semiconductor packaging.
- Familiarity with electrical and mechanical product inspections.
Education Requirements
Required: Bachelor's degree in Engineering or equivalent practical experience. Preferred: Master's degree in Engineering. Fields referenced include general engineering and electrical engineering; the posting explicitly allows equivalent industry experience in place of a degree.
About the Company
Company: Apple
Headquarters: Cupertino, California, United States
Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.
