Technical Program Manager

Job Title

Technical Program Manager

Role Summary

Lead end-to-end program management for Silicon Photonics and Advanced Packaging initiatives, coordinating cross-functional teams from concept through facility readiness and high-volume manufacturing ramp. Responsible for delivering strategic business objectives, customer requirements, and operational targets.

Experience Level

Senior — typically 10+ years of experience in semiconductor manufacturing and program or project management.

Responsibilities

Key responsibilities include planning, coordinating, and delivering complex technology and facility programs.

• Lead programs covering facility design, tool deployment, process development, and technology ramp to production.
• Develop integrated program plans, schedules, critical path tracking, and leading indicators.
• Coordinate cross-functional execution across engineering, operations, facilities, EHS, supply chain, IT, and external partners (OSATs, tool vendors).
• Manage CapEx and OpEx planning, procurement timing, and infrastructure readiness against budgets and business cases.
• Identify and manage program risks; drive mitigation plans and escalate critical issues with data-driven recommendations.
• Ensure manufacturing and technology readiness for scale and handoff to operations.
• Run program governance, executive reviews, and provide concise updates to senior leadership.
• Ensure compliance with Environmental, Health, Safety, and Security standards throughout program phases.

Requirements

Must-have technical and professional qualifications.

• 10+ years of experience in semiconductor manufacturing with strong program management exposure.
• Proven track record leading large-scale, cross-functional programs (facility builds, technology ramps, or new product introductions).
• Strong understanding of semiconductor fab operations, packaging flows (wafer-level, die-level, assembly), and equipment ecosystems.
• Experience managing budgets and aligning investments to business cases.
• Demonstrated ability to coordinate global teams and influence without direct authority.
• May require obtaining a U.S. Department of Defense security clearance; candidates must be prepared to answer citizenship and background questions.
• Nice-to-have: experience with advanced packaging and/or silicon photonics technologies; experience running multi-million-dollar CapEx programs.

Education Requirements

Bachelor’s or master’s degree in engineering (Electrical, Mechanical, Materials, or related field) required; advanced degree preferred.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.