Technical Director
Member of the Wireless Connectivity Modem Systems team responsible for transceiver DSP architecture, PHY-layer algorithm development, verification, silicon bring-up, RF modeling and production support for next-generation Wi‑Fi and narrowband chipsets.
Senior — technical director level. No specific years of experience stated.
Primary responsibilities include design, verification and characterization of PHY-level performance and supporting silicon bring-up.
Core technical skills and environment expectations.
Master's degree: M.S.E.E. (Master of Science in Electrical Engineering) with focus or experience in wireless communications. The posting specifies an M.S.E.E.; industry experience in wireless communications is expected.
Salary range (California estimate): $225,800 to $310,500 per year.
Company: NXP Semiconductors
Headquarters: Nijmegen, Netherlands
NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.
