TD Media and Collaterals Development Engineer

Job Title

TD Media and Collaterals Development Engineer

Role Summary

Develop assembly processes, equipment, and test methods to support Intel's packaging platform technologies. Work includes process development, manufacturability, material specification, supplier coordination, and reliability qualification for semiconductor packages.

Requires regular onsite presence for hands-on equipment work, testing, and supplier interactions.

Experience Level

Entry-level — approximately 0–3 years of experience. Minimum 6 months of relevant development experience is required.

Responsibilities

Key responsibilities include:

• Develop assembly processes and equipment to enable packaging platform roadmap.
• Optimize manufacturing to meet quality, reliability, cost, yield, productivity, and manufacturability targets.
• Create process and equipment specifications and apply DOE/SPC and statistical analysis to validate improvements.
• Design and maintain equipment to evaluate silicon and package technologies under heat, humidity, temperature cycling, and dynamic forces.
• Ensure manufacturability of package physical layouts and oversee manufactured package process flows and procedures.
• Establish material specifications and coordinate with supplier quality and procurement to meet vendor performance requirements.
• Develop acceleration methods, tools, and quality screens to identify packaging issues early.
• Define reliability requirements and influence design, material selection, and process development based on failure-mechanism understanding.
• Provide technical consultation on packaging problems and support customer/client requests or events.
• Standardize product qualification, manufacturing quality systems, and engage cross-functional teams on process maturity.

Requirements

Must-have and preferred technical skills.

• Must-have: Minimum 6 months of development experience applying fundamental science and engineering concepts; practical knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Must-have: Strong analytical and problem-solving skills; ability to document improvements and produce technical reports.
• Must-have: Regular onsite presence is required to fulfill essential job responsibilities.
• Preferred: Mechanical design software experience (SolidWorks, AutoCAD).
• Preferred: Portfolio of projects from concept to fabrication.
• Preferred: Experience with assembly equipment, process media, or collaterals.
• Preferred: Understanding of semiconductor fabrication processes and related technical/analytical skills.
• Other: This position is not open to Intel immigration sponsorship.

Education Requirements

Bachelor's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Physics, or a related technical discipline; or a Master's in one of these fields. The posting indicates required qualifications may be obtained through a combination of industry experience, internships, coursework, or research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.