NXP Semiconductors logo

Systems IC Architect

NXP Semiconductors
May 18, 2026
Full-time
On-site
Austin, Texas, United States
ASIC Design Jobs, Level - Senior

Job Title

Systems IC Architect

Role Summary

Senior technical lead responsible for system-level architecture and definition of Point-of-Load (PoL) power solutions, with a focus on advanced power management and System-in-Package (SiP) integration. The role works with product line leaders, IC architects, and R&D to define products, roadmaps, and technical solutions for high-performance compute and automotive power applications.

Experience Level

Senior-level. The posting indicates an expectation of extensive industry experience (around 15+ years).

Responsibilities

Key responsibilities include product definition, system integration, technical leadership, and stakeholder reporting.

  • Define System IC architecture, product concepts, and specifications for PoL power semiconductor modules and SiP solutions.
  • Develop and maintain long-term product and technology roadmaps with product and R&D teams.
  • Translate customer requirements into packaging and power-management solutions; perform thermal optimization and electrical analysis.
  • Collaborate with system solution architects and IC product architects to meet performance, efficiency, space, and cost targets.
  • Lead integration of ICs and power semiconductors into advanced packages and systems, with SiP integration focus.
  • Drive early-phase engineering and architecture for AI compute platforms, automotive 48V systems, and electrification platforms.
  • Provide technical advisory, benchmark state-of-the-art technologies, and report KPIs and project status to executives.
  • Lead cross-functional global teams and manage complex development projects.

Requirements

Essential and desirable technical skills and experience.

  • Must-have:
    • 15+ years experience in power semiconductors, packaging, and system-level integration.
    • Deep expertise in Advanced Power Management for Point-of-Load (PoL) solutions and System-in-Package (SiP) integration.
    • Proven track record in product definition and taking products to revenue.
    • Strong capabilities in thermal management, electrical performance, and reliability engineering.
    • Proficiency with circuit simulation tools (examples: Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and understanding of PCB materials and stack-up.
    • Experience powering high-performance compute SoC platforms; AI compute power experience emphasized as critical.
  • Nice-to-have:
    • Automotive power-management experience (48V systems) and familiarity with automotive-grade requirements.
    • Experience with Functional Safety standards (ISO 26262 and/or IEC 61508).
    • Experience leading global, cross-functional teams and complex projects; willingness to travel globally.

Education Requirements

Master's degree in Power Electronics, Electrical Engineering, or a related field is stated as preferred; Ph.D. is listed as preferred. (Master's and Ph.D. mentioned in the posting.)


About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.

NXP Semiconductors logo

Date Posted: 2026-05-18