Job Title
Systems IC Architect
Role Summary
Senior technical lead responsible for system-level architecture and definition of Point-of-Load (PoL) power solutions, with a focus on advanced power management and System-in-Package (SiP) integration. The role works with product line leaders, IC architects, and R&D to define products, roadmaps, and technical solutions for high-performance compute and automotive power applications.
Experience Level
Senior-level. The posting indicates an expectation of extensive industry experience (around 15+ years).
Responsibilities
Key responsibilities include product definition, system integration, technical leadership, and stakeholder reporting.
- Define System IC architecture, product concepts, and specifications for PoL power semiconductor modules and SiP solutions.
- Develop and maintain long-term product and technology roadmaps with product and R&D teams.
- Translate customer requirements into packaging and power-management solutions; perform thermal optimization and electrical analysis.
- Collaborate with system solution architects and IC product architects to meet performance, efficiency, space, and cost targets.
- Lead integration of ICs and power semiconductors into advanced packages and systems, with SiP integration focus.
- Drive early-phase engineering and architecture for AI compute platforms, automotive 48V systems, and electrification platforms.
- Provide technical advisory, benchmark state-of-the-art technologies, and report KPIs and project status to executives.
- Lead cross-functional global teams and manage complex development projects.
Requirements
Essential and desirable technical skills and experience.
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Must-have:
- 15+ years experience in power semiconductors, packaging, and system-level integration.
- Deep expertise in Advanced Power Management for Point-of-Load (PoL) solutions and System-in-Package (SiP) integration.
- Proven track record in product definition and taking products to revenue.
- Strong capabilities in thermal management, electrical performance, and reliability engineering.
- Proficiency with circuit simulation tools (examples: Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and understanding of PCB materials and stack-up.
- Experience powering high-performance compute SoC platforms; AI compute power experience emphasized as critical.
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Nice-to-have:
- Automotive power-management experience (48V systems) and familiarity with automotive-grade requirements.
- Experience with Functional Safety standards (ISO 26262 and/or IEC 61508).
- Experience leading global, cross-functional teams and complex projects; willingness to travel globally.
Education Requirements
Master's degree in Power Electronics, Electrical Engineering, or a related field is stated as preferred; Ph.D. is listed as preferred. (Master's and Ph.D. mentioned in the posting.)
About the Company
Company: NXP Semiconductors
Headquarters: Nijmegen, Netherlands
NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.

Date Posted: 2026-05-18