SW/CAD Engineer - Physical Design

Job Title

SW/CAD Engineer - Physical Design

Role Summary

Join the CES-3DIC team to develop software and workflows for 2.5D/3D System-in-Package (SiP) and ASIC physical implementation. The role focuses on integrating EDA and MCAD tools to enable floorplanning, place-and-route, verification, multi-die analysis, and manufacturing test.

Experience Level

Mid-level. Typical experience ranges from ~2–5 years depending on degree (see Education Requirements for specifics).

Responsibilities

Work on software modules, automation, and flows that support physical design and advanced packaging.

• Design, implement, test, document, and maintain software modules and subsystems for physical design, place-and-route, and 3D packaging.
• Develop scalable automation and customized workflows using Python, Tcl/Tk, Bash, and related scripting tools.
• Improve physical design and packaging flows focused on performance, power, and area (PPA) optimization.
• Support floorplanning, placement, routing, clock-tree synthesis (CTS), timing closure, and physical verification flows for 3D ICs and advanced packaging.
• Identify and resolve complex tool, data, workflow, and packaging issues across teams.
• Collaborate with CAD, packaging, and physical implementation teams to specify and deliver workflow requirements.
• Contribute to integration of 3D IC/3DStack architectures and industry-standard packaging solutions.
• Manage EDA infrastructure and design data: tool installation/upgrades, server environment setup (Linux/Windows), resource monitoring, and troubleshooting.

Requirements

Must-have technical skills and working habits; preferred items listed separately.

• Strong scripting skills: Python, Tcl/Tk, Shell/Bash.
• Solid software fundamentals: data structures and development on Windows and Linux.
• Experience with flow managers and Makefiles for building and orchestrating complex design workflows.
• Experience in design data management and administering EDA tool infrastructure at scale.
• Deep practical knowledge of ASIC physical design methodologies: netlist-to-GDS flow, floorplanning, placement, routing, CTS, timing closure, and physical verification.
• Familiarity with version control systems (e.g., Git) and software development methodologies (Agile/Scrum).
• Able to work independently and collaboratively with minimal supervision; effective English communication skills.

Nice-to-have:

• Hands-on experience with place-and-route tools (Cadence Innovus, Synopsys Fusion/ICC2, Siemens Aprisa) and physical verification tools (Calibre DRC/LVS/PEX).
• Familiarity with package design and planning tools (Cadence APD/SiP, Siemens Xpedition, Innovator 3D IC, Synopsys 3DIC Compiler).
• Experience with 3D IC/3DStack implementations and IC analysis tools for signal/power/thermal (HyperLynx, Ansys HFSS, RedHawk, Cadence Voltus, Synopsys PrimeTime).
• Knowledge of advanced process nodes (FinFET) and their physical-design implications.

Education Requirements

Bachelor's degree with 4+ years of relevant experience, or a Master's degree with 2+ years, in Computer Science, Computer Engineering, Electrical Engineering, or a closely related technical field.

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.