Substrate Packaging Research and Development Engineer

Job Title

Substrate Packaging Research and Development Engineer

Role Summary

Develop and qualify advanced package assembly processes and equipment to support Intel's packaging technology roadmap. Work with cross-functional teams to improve manufacturability, reliability, yield, and cost for advanced substrate and package assembly technologies.

This position is part of Packaging Technology Development and requires regular onsite presence under a hybrid work model.

Experience Level

Mid-level (typical candidates have multiple years of relevant industry or research experience; this role expects hands-on process development experience).

Responsibilities

Key responsibilities include process and equipment development, reliability assessment, and manufacturing transfer.

• Develop and optimize assembly processes and equipment for advanced package technologies.
• Design and execute experiments using DOE and statistical analysis to qualify processes and drive improvements.
• Establish and maintain process and equipment specifications; document results and write technical reports/white papers.
• Develop and operate test equipment to evaluate silicon and package reliability under thermal, humidity, mechanical, and dynamic stress conditions.
• Define material specifications and work with suppliers and contract assemblers to ensure material and vendor performance.
• Develop screening methods and accelerated test techniques to detect potential quality and reliability issues early.
• Provide technical consultation to resolve packaging problems and support product qualification and manufacturing readiness.

Requirements

Minimal and preferred technical qualifications and skills.

• Must-have: 2+ years of experience in process development, equipment optimization, or packaging R&D with hands-on experimental work.
• Must-have: Experience with design of experiments, statistical data analysis, and statistical process control.
• Must-have: Experience in material characterization techniques and applying engineering judgment to interpret data and build models.
• Must-have: Strong problem-solving skills and experience documenting technical work (reports, specifications).
• Nice-to-have: Experience with optics/lasers, laser micro-machining, or micro-fabrication.
• Ability to work on-site as required and collaborate with cross-functional engineering and supplier teams.

Education Requirements

PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a similar engineering discipline specified as the minimum qualification.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.