Strategic Student Program - Cross-Domain Manufacturing Systems Engineering Intern (Spring 2027)
SiemensJob Title
Strategic Student Program - Cross-Domain Manufacturing Systems Engineering Intern (Spring 2027)
Role Summary
Internship within the Cross Product Solution Management (CPSM) team focused on integrating EDA, PLM, CAE, and AI workflows across semiconductor, PCB, mechanical, and system domains. The role supports research, prototype development, and demonstration of an end-to-end "silicon-to-rack" engineering digital thread.
Experience Level
Entry-level internship for university students (senior undergraduates or graduate students). Suitable for candidates currently enrolled in degree programs and seeking hands-on experience in semiconductor, packaging, PLM, and systems engineering.
Responsibilities
Work with senior engineers to research, prototype, document, and demonstrate cross-domain engineering workflows.
- Research and evaluate emerging semiconductor engineering technologies and workflows (including 3D-IC and advanced packaging).
- Develop software prototypes, automation tools, and proof-of-concept solutions.
- Support semiconductor, PCB, and system-level design, validation, and implementation concepts.
- Document technical findings via white papers, tutorials, and technical guides.
- Investigate AI-assisted engineering and documentation workflows and integrate with EDA/PLM tools.
- Help define and demonstrate an end-to-end engineering digital thread from silicon design through system deployment.
Requirements
Must-have qualifications and logistical constraints for candidates.
- Minimum 3.0 GPA.
- Authorized to work in the United States without current or future sponsorship.
- Ability to learn quickly and work independently; strong analytical and problem-solving skills.
- Excellent verbal and written communication skills; able to document technical work clearly.
- Self-motivated, curious, and adaptable to changing project needs.
- Work type: Hybrid. Primary location listed as Wilsonville, OR; projects may also involve Detroit, MI or limited remote work depending on degree level.
Preferred / nice-to-have:
- Exposure to semiconductor packaging design or related research.
- Interest or experience with CAE, EDA, PLM, automation, or AI technologies.
- Familiarity with Linux or scripting environments.
- Previous internship, co-op, or project experience in related domains.
Education Requirements
Currently enrolled university students: senior undergraduates, master's, or Ph.D. candidates. Pursuing degrees such as Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Electrical/Electronics Engineering, or related STEM fields. Graduating 2028 or later.
About the Company
Company: Siemens
Headquarters: Munich, Germany
Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.
