Staff RF Module Design Engineer

Job Title

Staff RF Module Design Engineer

Role Summary

Senior individual contributor responsible for design and development of RF/mm-wave single- and multi-chip modules and packaged products integrating GaN, GaAs or silicon MMICs. Work as part of an integrated product development team (marketing, program management, mechanical, package, test, applications, manufacturing, quality and reliability).

Primary focus is advanced RF/microwave package design, simulation, lab verification and supporting products from concept through production.

Experience Level

Senior-level (Professional). Position expects substantial hands-on experience in RF/mm-wave module design; see Education Requirements for degree-and-years guidance.

Responsibilities

Key duties include design, simulation, verification and support of RF/mm-wave module products.

• Develop single- and multi-chip RF/mm-wave modules and front-end modules (FEMs) including air-cavity and over-mold approaches.
• Integrate MMICs (amplifiers, switches, phase shifters, attenuators, etc.) into module designs.
• Perform advanced package design and electromagnetic simulation using 2.5D/3D EM tools.
• Conduct product checkout, optimization and design verification testing (DVT) in the lab; analyze and present results to internal and external stakeholders.
• Support product lifecycle stages: concept/feasibility, development, qualification and production.
• Mentor and provide technical guidance to other team members where applicable.

Requirements

Must-have technical skills and experience for this role.

• Experience integrating microwave/millimeter-wave MMIC dies into single- or multi-chip air-cavity or over-mold modules.
• Expert user of 3D EM simulation tools such as HFSS and/or Analyst; familiarity with circuit simulators (ADS, Microwave Office, Cadence/Spectre) is expected.
• Expertise evaluating package performance tradeoffs for AC/OVM QFN, laminates, FCBGA, LGA and similar package types.
• Strong understanding of electromagnetic theory and RF fundamentals (s-parameters, impedance matching, transmission lines, passive structures).
• Hands-on experience with microwave measurements, characterization and calibration methods.
• Knowledge of semiconductor technologies: GaN, GaAs and/or silicon.
• Broad knowledge of RF/power packaging, materials and assembly processes used in electronic assemblies.
• Strong written and oral communication skills to summarize technical concepts concisely.
• Position is not eligible for company visa sponsorship.

Nice-to-have:

• System-level RF signal chain and system analysis experience.
• Antenna design knowledge.
• Published author in technical journals or conferences.
• Proven ability to meet customer technical needs and schedules.

Education Requirements

Required degree-and-experience combinations: BS in Electrical Engineering with 8+ years of relevant experience; MS in Electrical Engineering with 5+ years; or PhD in Electrical Engineering (RF/Microwave focus) with 2+ years. (These are the specified formal education and experience options.)