Staff Process Engineer, APTD Bonding

Job Title

Staff Process Engineer, APTD Bonding

Role Summary

Join the Advanced Packaging Technology Development (APTD) Bonding team to develop, qualify, and optimize bonding and assembly processes for memory and storage products. Work closely with R&D, equipment and materials suppliers, and manufacturing to enable new product introductions and improve yield, reliability, and cost.

Experience Level

Senior-level. The role expects experienced engineers; the posting specifies a baseline of 5+ years of relevant industry experience.

Responsibilities

Accountable for process development, transfer, and problem resolution across bonding and assembly process steps.

• Develop and modify process formulations; define equipment requirements and specifications.
• Evaluate and optimize process, equipment, and material interactions; implement process changes.
• Start up and qualify new process baselines, tools, and materials for new product introductions.
• Identify, diagnose, and resolve assembly/process-related issues using root-cause methods.
• Support statistical process control (SPC/FDC), RMS/APC efforts, and site-to-site portability.
• Perform failure analysis and apply DOE, FMEA, 8D, or similar methodologies to improve yield and reliability.
• Audit and manage material supplier quality, cost, and risk.

Requirements

Must-have technical skills and experience required to perform the role.

• Minimum of 5 years relevant industry experience in semiconductor process engineering or packaging.
• Knowledge of advanced package integration and memory products (DRAM, NAND, or similar).
• Hands-on experience with DOE, statistical process control, defect analysis, and data analysis.
• Practical experience with process and equipment interactions across incoming/outgoing process steps.
• Proven ability to resolve complex technical issues using root-cause or model-based problem solving.
• Preferred: experience leading project teams and providing technical leadership updates.

Education Requirements

Minimum: BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics plus 5 years of relevant industry experience. Preferred: MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or Mechanical Engineering. No alternative-equivalent-experience language was specified beyond the degree + experience requirement.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.