Staff/Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)
Micron TechnologyJob Title
Staff/Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)
Role Summary
Lead the High Bandwidth Memory (HBM) Product Engineering Media Health team to develop and validate manufacturing and test flows for next-generation HBM products (DRAM, interface die, and stacked devices). Drive improvements in quality, cost, cycle time and scale across high-volume manufacturing.
Work across Fab, Design, Technology Development, Test Solution Engineering and Quality/Reliability teams to resolve yield and test issues, define DFT/test strategies, and deliver qualified products to manufacturing.
Experience Level
Senior - 8+ years of experience in the semiconductor industry; significant product engineering or manufacturing experience expected.
Responsibilities
Day-to-day responsibilities include leading technical programs, defining test and DFT strategies, and improving yield and test efficiency for HBM products.
- Lead development and validation of manufacturing test flows for DRAM, interface die and stacked HBM products.
- Define and optimize test coverage and DFT strategies to reduce test time, cost, and improve quality.
- Perform in-depth circuit debug and root-cause analysis to improve intrinsic and extrinsic reliability and device/stacked yield.
- Support design verification and product validation using CAD tools and Verilog simulations.
- Investigate and resolve manufacturing test flow issues, qualification and RMA device problems.
- Make technical decisions on risk, project prioritization and deliverables; manage programs to meet schedule and KPI targets.
- Mentor and develop engineering team members; build a high-performing team.
- Collaborate cross-functionally with Fab, design, technology development, system development and quality/reliability groups.
- Promote innovation in test strategy and tools to maintain technical leadership.
- Improve productivity and efficiency by leveraging data analysis, scripting and AI tools.
Requirements
Key skills and experience required or strongly preferred.
- Must have: Strong technical problem solving with root-cause circuit analysis and proven experience in manufacturing test flows.
- Must have: Experience with DFT, test coverage optimization, yield improvement and test time reduction in high-volume semiconductor manufacturing.
- Must have: Proficiency with statistics, data analysis tools and scripting for yield and test diagnostics.
- Must have: Demonstrated leadership, mentoring experience, and effective communication and presentation skills.
- Must have: Ability to work on site in Singapore; willing to travel internationally (US, Taiwan, Japan) as required.
- Preferred: Product engineering experience and prior work with CAD/Verilog simulations for design validation.
- Preferred: Experience leading technical teams in high-volume DRAM/HBM manufacturing.
Education Requirements
Bachelor's or Master's degree in Electrical and Electronics Engineering. The posting specifies 8+ years of semiconductor industry experience; product engineering experience is noted as preferred.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
