Staff/Principal, APTD CEM - Advanced Packaging Wafer-Level Technology Engineering

Job Title

Staff/Principal, APTD CEM - Advanced Packaging Wafer-Level Technology Engineering

Role Summary

Lead development and deployment of post-fab wafer finishing and wafer-level packaging processes to meet performance, cost, manufacturability, quality, reliability, and schedule targets for high-performance memory packages. Work within Micron's Advanced Packaging Technology Development (APTD) team and coordinate across integration, assembly, front end, product engineering, and quality teams to deliver technology and transfer to high-volume manufacturing.

Experience Level

Senior-level. The role expects substantial domain experience in semiconductor process development and technology transfer; see Education Requirements for degree-to-experience mapping.

Responsibilities

Accountable for process, equipment, quality, and cross-functional coordination required to develop and transfer wafer-level packaging technologies.

• Develop and optimize wafer-level processes (wafer thinning, backside metal interconnect) and scale for the next technology node.
• Improve process capability and reduce production cost through process and equipment improvements.
• Evaluate, qualify, and plan for new equipment and materials; define process parameters and set up semiconductor equipment.
• Implement measurement, inspection, and test strategies; perform data analysis to establish advanced controls and identify improvement opportunities.
• Collaborate with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to integrate processes and enable smooth transfer from development to HVM.
• Provide Process of Record (POR) and Model of Record (MOR) documentation for product transfer to production fabrication facilities.
• Integrate AI-assisted tools and insights into day-to-day work to improve efficiency, quality, and effectiveness and share proven AI-enabled improvements.

Requirements

Must-have technical skills, domain experience, and interpersonal capabilities required to perform the responsibilities above.

• Proven semiconductor process development experience, preferably in wafer bonding, plating, warpage control, or packaging.
• Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Deep understanding of process flows, process interactions, and impacts on yield, performance, and reliability.
• Strong analytical and problem-solving skills, effective communication, leadership, and stakeholder management.
• Ability to work independently and collaboratively across functions in a fast-paced environment and to support technology transfer to HVM.
• Role-appropriate AI literacy and ability to use AI-enabled tools responsibly to support research, analysis, and operational tasks.

Education Requirements

PhD with ≥2 years, or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.