Staff PCB - Package Co-design Engineer

Job Title

Staff PCB - Package Co-design Engineer

Role Summary

Experienced electronics engineer responsible for PCB and silicon package co-design within Arm's Packaging, Boards and Multiphysics team. The role focuses on developing physical hardware platforms for software development and validation, influencing silicon architecture, package pinout trade-offs and ensuring PCB-package integration meets performance, reliability and cost targets.

Experience Level

Senior / Staff level. Specific years of experience not stated, but role requires substantial hands-on experience in PCB and package co-design and the ability to lead technical trade-offs.

Responsibilities

Key responsibilities include specifying, evaluating and delivering PCB-package integration solutions and driving PCB development alongside chip packaging teams.

• Collaborate with cross-functional engineering teams across geographies to define PCB and package integration requirements.
• Influence silicon architecture and package pinouts to optimize routability, cost, and performance.
• Define breakout and routing strategies, design rules, layer-stack optimization, and layout constraints.
• Perform escape routing analysis and provide estimates of routable IO counts for given stack-ups and design rules.
• Conduct signal and power integrity analysis from both board and package perspectives to ensure signal quality at high speeds.
• Support early silicon and board architecture planning, including component placement, PDN strategy, and form-factor constraints.
• Assess manufacturability with PCB fabricators and CEM partners and provide timescale estimates and justifications to program teams.

Requirements

Must-have technical skills and capabilities.

• Strong understanding of electronics and embedded compute systems.
• Familiarity with IC packaging technologies and how they impact PCB design and integration.
• Proven experience collaborating with chip packaging teams and influencing SoC pin-outs for routing feasibility and cost optimization.
• Detailed knowledge of high-speed interfaces and standards (example: PCIe, LPDDR) and high-speed routing best practices.
• Expertise in escape routing analysis for high-density SoCs.
• Extensive signal integrity (SI) and power integrity (PI) analysis experience from board and package viewpoints.
• Understanding of PCB fabrication processes (PTH, HDI), stackups, VIA topologies and substrate materials.
• Proficiency with EDA tools for schematic entry and PCB layout (Cadence OrCAD & Allegro).
• Good communication and interpersonal skills, attention to detail.

Nice-to-have:

• Experience with SI tools (ANSYS, Siemens EDA, etc.).
• Design automation and scripting experience.
• Experience working across geographies and with distributed teams.

Education Requirements

Not specified.

About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.