Staff Packaging Layout Engineer
Engineer in Arm's System-in-Package team responsible for implementing package layouts for next-generation SoCs across IoT, Automotive, and Compute domains. Work includes 2.5D and 3D packaging, signal and power integrity considerations, and coordination with IP, PCB, SI/PI, systems teams, and external vendors.
Senior β 10+ years of relevant industry experience, including extensive use of Cadence APD & Allegro.
Primary responsibilities are design and verification of package layouts and collaboration across internal and external teams to deliver manufacturable packages.
Key technical and professional requirements. Education requirement moved to Education Requirements section below.
Bachelor's degree in Electrical Engineering or equivalent technical degree, or equivalent practical experience.
Company: Arm
Headquarters: Cambridge, United Kingdom
ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.
