Staff Packaging Engineer - Process Package Integrity & Bumping

Job Title

Staff Packaging Engineer - Process Package Integrity & Bumping

Role Summary

Lead process integration and qualification for wafer bumping (Far-BEOL) across multiple nodes, foundries, bumping lines, and OSATs to enable advanced packaging (flip-chip, RDL/fan-out, 2.5D/3DIC). Primary responsibilities include defining bump process flows, establishing process windows and controls, executing DOE-based optimization, and driving supplier bring-up and production readiness.

This role partners with foundry FBEOL teams, bumping/assembly partners, internal package design, process, quality, test, and product development teams to deliver robust, high-yield bumping solutions.

Experience Level

Senior / Staff level. Typical guidance: 8–10+ years hands-on experience in silicon interconnect, bumping and/or RDL process, qualification, and production; alternatives of less experience are acceptable with higher degrees per company minimum-qualification structure.

Responsibilities

Primary responsibilities for the role include process development, qualification, and production readiness of bumping solutions.

• Define and implement wafer bumping process flows (passivation openings, UBM, RDL, solder/Cu pillar bump formation) and associated process controls.
• Establish process windows, control plans, SPC, GR&R and perform DOE-based process optimization.
• Lead bumping house/line bring-up, tooling/equipment qualification, and high-volume manufacturing ramp activities.
• Partner with foundries, bumping/assembly suppliers, and OSATs on process integration, change control, line qualification, and capacity expansion.
• Drive failure analysis, metrology and inline control strategies, FMEA, and statistical analysis to improve yield and reliability.
• Design and execute test vehicles/structures for bump/RDL characterization and process-package interaction tests (reliability, electromigration, mechanical integrity).
• Manage projects and supplier relationships, define KPIs, contain yield excursions, and implement continuous improvement programs.
• Collaborate with package and chip design teams to address bump/assembly interactions (coplanarity, warpage, pitch scaling) and downstream assembly impacts.

Requirements

Required technical skills and proven experience for immediate contribution.

Must-have:

• Deep expertise in Far-BEOL bumping process modules and integration, including UBM, RDL (where applicable), and bump formation methods.
• Experience with flip-chip bump design intent and assembly interactions (bump metallurgy, pitch scaling, coplanarity, warpage).
• Strong skills in metrology, inline process controls, failure analysis, DOE design, statistical data analysis, and FMEA.
• Track record leading bumping process qualification, NPI release activities, and HVM readiness.
• Hands-on manufacturing execution for bump structures and bump line operations, including new line bring-up and production ramp.
• Supplier management and project leadership experience with external bumping houses/OSATs.
• Experience interfacing with foundries on process integration, change control, and multi-source readiness.
• Familiarity with chip and substrate design tools such as Calibre, Virtuoso, CAD, SiP, and GDS.

Nice-to-have:

• Experience with heterogeneous integration (2.5D/3DIC), fine-pitch micro-bumps, and fan-out RDL process interactions.
• Published technical reports or demonstrated prior technical leadership in packaging process development.
• Willingness to work flexible hours and travel occasionally for domestic/international supplier or foundry engagements.

Education Requirements

Degree expectations: Bachelor's, Master's, or Ph.D. in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field. Example minimum qualifications described: Bachelor's + ~4 years relevant experience; Master's + ~3 years; Ph.D. + ~2 years. Equivalent practical experience considered where noted by employer.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.