Staff Packaging Engineer

Job Title

Staff Packaging Engineer

Role Summary

Responsible for development of advanced 2.5D packaging technologies and definition of baseline assembly processes optimized for performance, reliability, yield, and cost for high-performance computing products. The role leads cross-functional teams, manages foundries and OSATs, and resolves complex chip-package interaction and manufacturing issues.

Experience Level

Senior — preferred 6+ years hands-on packaging technology experience. Minimum experience varies by degree (see Education Requirements).

Responsibilities

Key responsibilities include development, deployment, and transfer of package assembly processes and driving cross-functional execution.

• Develop and optimize assembly processes for large-body FCBGA/LGA and FCCSP packages (die prep, chip attach, underfill, lid/stiffener attach, ball attach).
• Plan and execute DOE, analyze data, and implement process improvements to meet performance, reliability, yield, and cost targets.
• Define packaging architecture and chip-package interaction requirements for 2.5D solutions.
• Work with OSATs, material vendors, equipment suppliers, and foundries to bring up new processes and drive NPI and high-volume manufacturing (HVM) deployment.
• Lead cross-functional teams to resolve complex technical issues and deliver programs on schedule.
• Support packaging structure design decisions and integration with product teams.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• Must-have: Hands-on experience with IC package assembly processes (die attach, underfill, lid/stiffener, ball attach) and process optimization.
• Must-have: Experience planning/executing DOE, performing data analysis, and driving process yield and reliability improvements.
• Must-have: Proven ability to lead cross-functional teams and manage external partners (OSATs, foundries, suppliers).
• Must-have: Strong analytical, project management, and communication skills.
• Nice-to-have: Experience with ABF buildup substrates, EMIB, wafer bumping processes, PoP, SiP, and 2/2.5D packaging.
• Nice-to-have: Familiarity with reliability standards, qualification procedures, failure analysis techniques, and substrate manufacturing/design rules.

Education Requirements

Bachelor's degree in Chemical, Electrical, Mechanical Engineering or related field with 4+ years of relevant experience; OR Master's degree in the same fields with 3+ years; OR PhD with 2+ years. Preferred: M.S. in Mechanical, Electrical, or Materials Engineering or equivalent. The posting allows degree-plus-experience combinations as specified above.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.