Staff Package Design Engineer — Power SiP/Module

Job Title

Staff Package Design Engineer — Power SiP/Module

Role Summary

Design and qualify packaging and interconnect solutions for power SiP/modules and related packaging technologies (wafer-level, flip-chip, multi-chip modules) to support product development and production at the Zhubei site.

Work cross-functionally with product groups, reliability, quality, OSATs/contract manufacturers and operations to transfer designs into production, establish process controls, and ensure product quality and reliability.

Experience Level

Senior level — 6 to 12 years of relevant package development experience.

Responsibilities

Core responsibilities include design, qualification, and production transfer of power packaging solutions.

• Develop package designs and interconnect methods for Power SiP/modules, wafer-level, flip-chip, multi-chip modules and power device packaging.
• Plan and execute material, process selection and qualification for consumer, industrial and automotive power applications.
• Benchmark and qualify materials, processes and assembly subcontractors or contract manufacturers.
• Work with OSATs/CMs to develop processes, run DOE, optimize yields and establish process specifications.
• Collaborate with product, reliability and quality teams to qualify new packages and resolve process integration issues.
• Establish production controls, monitor ramp-up and address production/process issues to maintain product quality.
• Maintain technical expertise on packaging advances, contribute to roadmap development, and establish package design rules.
• Investigate and resolve internal and external customer complaints in coordination with cross-functional teams.

Requirements

Must-have technical skills and experience; nice-to-have items noted.

• 6–12 years of experience in package development emphasizing power SiP/module, wafer-level and flip-chip packaging.
• Strong understanding of assembly processes, qualification methods, SPC and statistical analysis tools.
• Experience working with OSATs/contract manufacturers and executing DOE for process optimization.
• Proven ability to establish process specs, production controls and ramp-up monitoring.
• Strong analytical, presentation, interpersonal and communication skills.
• Nice to have: knowledge of wire-bonding and multi-chip module technologies.

Education Requirements

Doctorate, Master’s or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.