Staff Package Design Engineer

Job Title

Staff Package Design Engineer

Role Summary

Design and deliver advanced semiconductor packaging solutions (2.5D/3D, chiplet-based, FCBGA, SiP, WLCSP, wire bond, QFP/QFN) for automotive SoCs, industrial microcontrollers, and AI computing platforms. Work on package layout execution, manufacturability, and cross-domain co-design with silicon, SI/PI, thermal, and reliability teams.

Experience Level

Mid-level — typical candidates have 4+ years of hands-on package CAD/layout experience.

Responsibilities

Execute and manage package design from layout through manufacturing outputs and support cross-domain reviews and manufacturing interfaces.

• Perform package layout and development for advanced package types (2.5D/3D IC, FCBGA, SiP, WLCSP, multi-chip modules).
• Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
• Develop and maintain package CAD databases and ensure adherence to design guidelines, DFM and DFA.
• Generate manufacturing deliverables (Gerbers, drill data, fabrication and assembly drawings).
• Ensure compliance with foundry and OSAT design rules (DRC, LVS) and manage ECOs and version control.
• Collaborate with SI/PI, thermal, reliability, and DFT teams; participate in design reviews and co-optimization activities.

Requirements

Must-have technical skills and experience for the role.

• 4+ years of hands-on experience in package CAD layout and development.
• Experience with 2.5D/3D IC packaging, FCBGA, advanced substrate-based packages, and multi-die/chiplet designs.
• High proficiency with industry tools such as Cadence Allegro Package Designer, Siemens Xpedition/Substrate Integrator, or equivalent.
• Experience interfacing directly with Tier-1 OSATs and foundries and working with advanced manufacturing design rules.
• Basic understanding of SI/PI fundamentals, high-speed routing, impedance control, and crosstalk mitigation.
• Strong communication, presentation, and documentation skills; experience working in global, cross-functional teams.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.