Staff Module Designer

Job Title

Staff Module Designer

Role Summary

Design and develop RF/mm-wave single- and multi-chip modules and packaged products integrating GaN, GaAs or silicon MMICs. Work on advanced packaging technologies, electromagnetic simulation, lab verification and cross-functional product development from concept through production.

Part of an integrated product team; may mentor junior engineers. This position requires US Person status and is not eligible for visa sponsorship.

Experience Level

Senior (Staff). The posting specifies degree-dependent experience thresholds (see Education Requirements); generally a senior-level engineer with several years of relevant RF/module experience is expected.

Responsibilities

Key responsibilities include:

• Individual contributor for RF/mm-wave single- or multi-chip module product development.
• Integrate MMIC(s) into air-cavity or over-mold modules for transmit/receive front-end modules (FEMs).
• Perform advanced package design using 2.5D and 3D electromagnetic simulators.
• Execute product checkout, optimization, and design verification testing (DVT) in the lab.
• Perform DVT analysis and present technical results to internal and external stakeholders.
• Support products through concept/feasibility, development, qualification and production phases.

Requirements

Must-have technical qualifications:

• Experience integrating microwave/millimeter-wave MMIC dies (amplifiers, switches, phase shifters, attenuators) in single- or multichip air-cavity or over-mold modules.
• Expert user of 3D EM tools such as HFSS and/or Analyst; familiarity with ADS, Microwave Office or Cadence circuit simulators.
• Expertise analyzing performance tradeoffs of package types (AC/OVM QFN, laminates, FCBGA, LGA, etc.).
• Strong understanding of electromagnetic theory and RF fundamentals (s-parameters, impedance matching, transmission lines, passive structures).
• Hands-on microwave measurement, characterization and calibration experience.
• Knowledge of semiconductor technologies such as GaN, GaAs and/or silicon, and RF/power packaging materials and assembly processes.
• Strong written and oral communication skills.
• Must be a US Person; role supports US Government contracts and is not eligible for visa sponsorship.

Nice-to-have:

• RF signal chain and system analysis experience.
• Antenna design experience.
• Published author in technical journals or magazines.
• Proven ability to meet customer technical needs and schedules.

Education Requirements

BS in Electrical Engineering with 8+ years relevant experience; or MS in Electrical Engineering with 6+ years; or PhD in Electrical Engineering (RF/Microwave focus) with 3+ years. Equivalent practical experience is implied by the degree-based experience alternatives.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.