Staff IC Packaging Engineer
QualcommJob Title
Staff IC Packaging Engineer
Role Summary
Lead development and commercialization of advanced integrated circuit (IC) packaging technologies from concept through high-volume manufacturing (HVM). The role partners with OSATs, foundries, substrate and material suppliers, and internal design and product teams to define package architectures, establish process flows, and ensure manufacturability and reliability.
Expect to provide technical leadership on multiple concurrent programs, drive new product introduction (NPI), and resolve complex process and manufacturing issues.
Experience Level
Senior. Qualification guidance from the posting: typical experience expectations vary by degree (examples provided by employer): Bachelor's +4 years; Master's +3 years; PhD +2 years of relevant System/Package Design or Technology Engineering experience.
Responsibilities
Primary responsibilities include technology development, transfer to manufacturing, cross‑functional program leadership, and reliability qualification.
- Lead development and deployment of advanced packaging technologies (FCCSP, FCBGA, SiP/modules, RDL-based packages, 2.5D/3D integration).
- Drive NPI from concept through transfer to OSATs and HVM, including defining process flows, material sets, and process control plans.
- Define and optimize package architectures, high-density interconnects, and die-to-die integration for performance and reliability trade-offs.
- Design and execute DOE, test vehicles, and process characterization for technology development and qualification.
- Collaborate with OSATs, foundries, substrate vendors, and material suppliers to align development with product and manufacturing requirements.
- Partner with internal design and modeling teams to implement Design for Manufacturability (DFM) and establish design rules.
- Lead cross-functional programs: manage timelines, risks, deliverables, and multiple concurrent projects.
- Apply FMEA, SPC/QC, reliability testing, and failure analysis to ensure robust product development and qualification.
- Troubleshoot and resolve complex technical and manufacturing issues across development and production stages.
Requirements
Must-have technical skills, hands-on experience, and working practices expected for the role.
- Deep experience in advanced IC packaging architectures and assembly processes (flip chip, wire bond, SiP, RDL, wafer bonding, 2.5D/3D).
- Proven track record driving NPI and transferring technologies into high-volume manufacturing with OSATs or contract manufacturers.
- Experience with high-density interconnect design, substrate technologies, and package architecture decisions.
- Hands-on knowledge of assembly processes, materials, equipment, wafer-level processes, dicing, and wafer-on-wafer bonding.
- Strong skills in DOE, statistical data analysis, process optimization, and use of SPC/QC methods.
- Experience with reliability standards, qualification methods, failure analysis, and root-cause problem solving.
- Ability to lead cross-functional technical programs, manage risk, and coordinate external suppliers and partners.
- Excellent communication and collaboration skills for multi-team integration.
- Nice-to-have: familiarity with laser groove technology, wire bond process optimization, and Six Sigma certifications.
Education Requirements
Employer specifies degree-based alternatives: Bachelor's in Chemical, Electrical, Mechanical Engineering, or related field (with ~4+ years relevant experience); OR Master's in a related engineering field (with ~3+ years); OR PhD in a related engineering field (with ~2+ years). The posting also references related technical fields and notes equivalent practical experience and industry certifications (e.g., Six Sigma) as advantageous.
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.
