Staff HBM Design Architect
Member of the HBM Architecture team designing and analyzing digital, analog, and mixed-signal circuits for advanced HBM memory products. Work focuses on evaluating functionality, optimizing performance (timing, power, area), and performing architectural feasibility/pathfinding for next-generation HBM used in AI, ML, and HPC.
This role partners with architecture, design, and verification teams to ensure functional correctness and scalable, high-performance memory designs.
Senior — minimum 3+ years of relevant engineering experience.
Key responsibilities include circuit- and chip-level design, analysis, and architectural evaluation for high‑bandwidth memory (HBM) products.
Summary of required and preferred skills and experience (education details are in the Education Requirements section below).
Must-have:
Nice-to-have:
Bachelor's degree in Electrical Engineering or a related field is required. Master's degree or higher in Electrical Engineering or a related field is preferred.
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
