Staff Failure Analysis Engineer - Advanced Packaging Technologies

Job Title

Staff Failure Analysis Engineer - Advanced Packaging Technologies

Role Summary

Lead development and enablement of failure-analysis (FA) hardware: test interfaces, sockets, and thermal management for advanced semiconductor packages. Support electrical fault isolation, design debug, yield improvement, and RMA analysis across Qualcomm product lines.

Work with cross-functional teams and external suppliers to deploy scalable FA solutions for high‑pin‑count, high‑power devices in mobile, compute, automotive, and networking platforms.

Experience Level

Senior. Typical qualification paths from the posting: Bachelor’s +4 years, Master’s +3 years, or PhD +2 years of relevant hardware engineering or FA experience.

Responsibilities

Key responsibilities include designing and delivering FA hardware and enabling FA workflows:

• Lead FA test interface enablement across Mobile, Compute, Automotive, Networking, and AR/VR platforms.
• Design and deploy custom sockets, carrier boards, and interface hardware for ATE and platform-based testing.
• Define minimal socket/interface variants to cover FA scenarios and ensure hardware readiness by Silicon on Dock (SOD).
• Design and implement thermal management solutions for high‑TDP devices.
• Perform thermal and electrical analysis to assess performance and reliability of FA hardware.
• Create detailed hardware specifications and coordinate with suppliers and internal teams for integration.
• Collaborate with Design, Product Engineering, Yield, and Reliability to align FA capabilities with product requirements.
• Monitor emerging packaging and socketing technologies and update FA strategies accordingly.

Requirements

Must-have technical skills and experience:

• Practical experience in hardware design, test interfaces, or failure analysis enablement.
• Hands‑on knowledge of socketing technologies, power delivery, and signal integrity for advanced packages.
• Experience supporting FA or debug activities for complex SoCs or high‑pin‑count devices.
• Familiarity with thermal analysis and mitigation techniques for high‑power semiconductor devices.
• Ability to translate FA requirements into clear hardware specifications.
• Strong collaboration and communication skills across multidisciplinary and global teams.

Nice-to-have:

• Experience with carrier board development, ATE environments, and supplier management.

Education Requirements

Degree paths specified: Bachelor’s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field (with 4+ years of hardware engineering or related experience); OR Master’s degree in those fields (with 3+ years); OR PhD (with 2+ years). Posting notes Bachelor’s as required and Master’s in Electrical Engineering or related discipline as preferred.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.